Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact

• US 20050126766A1
• Filed: 09/16/2004
• Published: 06/16/2005
• Est. Priority Date: 09/16/2003
• Status: Abandoned Application

• Current Assignee: Nasreen Chopra
• Original Assignee: Koila, Inc.
• Inventors: Lee, Ju-Hyung, Chopra, Nasreen G.
• Application Number:
  US10/944,485
• Publication Number:
  US 20050126766A1
• Time in Patent Office: Days
• US Class Current: 165/133
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: F28F 13/185 Heat-exchange surfaces provided with microstructures or with porous coatings
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Nanostructures provide improved contact to augment heat-exchange surfaces of various devices or structures. In one embodiment, an article of manufacture has a body having a heat-exchanging surface and nanostructures disposed on the heat-exchanging surface. The nanostructures are arranged to enhance thermal transfer between said body and an object distinct from said body and may be arranged to form a substantially continuous film. Examples of suitable nanostructures include carbon and/or boron nitride nanotubes, which may be grown on the heat-exchanging surface.

Claims

1. An article of manufacture, comprising:

a body having a first heat-exchanging surface; and

a plurality of first nanostructures disposed on said first heat-exchanging surface,

wherein said first nanostructures are arranged to enhance thermal transfer between said body and an object distinct from said body.

2. The article of claim 1 wherein said first nanostructures form a substantially continuous film.

3. The article of claim 1 wherein said first nanostructures include a plurality of nanotubes.

4. The article of claim 3 wherein said nanotubes form a substantially continuous film.

5. The article of claim 3 wherein said nanotubes are grown onto said first heat-exchanging surface.

6. The article of claim 3 wherein said nanotubes are generally aligned along a common axis.

7. The article of claim 6 wherein said common axis is oriented to be substantially normal to the surface of the object.

8. The article of claim 3 wherein said nanotubes are randomly oriented.

9. The article of claim 3 wherein said nanotubes include carbon nanotubes and/or boron nitride nanotubes.

10. The article of claim 5 wherein said nanotubes include single-walled nanotubes and/or multi-walled nanotubes.

11. The article of claim 3 wherein at least one of said nanotubes has a kinked section.

12. The article of claim 1 wherein said nanostructures include nanorods and/or nanowires.

13. The article of claim 12 wherein said nanowires include a nanowire made of a metal.

14. The article of claim 13 wherein said metal is selected from the group consisting of indium, copper, nickel and aluminum.

15. The article of claim 1 wherein said body is composed of at least one of copper, aluminum, a copper alloy or an aluminum alloy.

16. The article of claim 1 wherein said body is composed of a nano-composite material that includes a base material and nanostructures incorporated into the base material.

17. The article of claim 1 wherein said body is composed of a composite material that includes a base material and a second material with high thermal conductivity, said second material being dispersed in said base material.

18. The article of claim 17 wherein said second material is selected from a group consisting of graphite, diamond crystal, diamond particles, and diamond dust.

19. The article of claim 1 wherein said body is composed at least in part of at least one material selected from a group consisting of copper, aluminum, titanium, indium, nickel, magnesium, graphite, iron, and stainless steel.

20. The article of claim 1 wherein said body is composed at least in part of a plastic.

21. The article of claim 1 wherein said body is composed at least in part of a ceramic.

22. A structure for enhancing thermal transfer between an object and a region of fluid distinct from the object, the structure comprising:

a body having a first surface adapted to contact the object and a second surface adapted to contact the fluid;

a plurality of nanostructures disposed on said first surface and arranged so as to enhance thermal transfer between said body and the object.

23. The structure of claim 22 wherein said second surface includes a plurality of macroscopic fins extending outward therefrom.

24. The structure of claim 22 wherein said nanostructures include nanotubes.

25. The structure of claim 24 wherein said nanotubes form a substantially continuous film.

26. The structure of claim 24 wherein said nanotubes include boron nitride nanotubes and/or carbon nanotubes.

27. The structure of claim 24 wherein said nanotubes are generally aligned along a common axis.

28. The structure of claim 27 wherein said common axis is substantially normal to said first surface.

29. The structure of claim 24 wherein said nanotubes are randomly oriented.

30. The structure of claim 22 wherein said body is composed of a nano-composite material that includes a base material and nanostructures incorporated into the base material.

31. The structure of claim 22 wherein said body is composed at least in part of at least one material selected from a group consisting of copper, aluminum, titanium, indium, nickel, magnesium, graphite, iron, and stainless steel.

32. The structure of claim 22 wherein said body is shaped as a heat sink.

33. The structure of claim 22 wherein said body is shaped as a heat pipe.

34. The structure of claim 22 wherein said body is shaped as a microfluidic cooling structure.

35. A package for a heat generating device, the package comprising:

a housing adapted to enclose the heat generating device, said housing having an inner surface and an outer surface; and

a plurality of first nanostructures disposed on at least a portion of said inner surface and arranged to enhance thermal transfer between the heat generating device and said housing.

36. The package of claim 35 wherein the heat generating device comprises an integrated circuit.

37. The package of claim 35 wherein said housing is composed at least in part of nickel-plated copper.

38. The package of claim 35 wherein said nanostructures include nanotubes.

39. The package of claim 38 wherein said nanotubes include electrically insulating nanotubes.

40. The package of claim 38 wherein said nanotubes include boron nitride nanotubes.

41. The package of claim 38 wherein said nanotubes are generally aligned along a common axis.

42. The package of claim 38 wherein said nanotubes are randomly oriented.

43. A method for augmenting a heat-exchanging surface of a first object, the method comprising:

applying a plurality of nanostructures to the heat-exchanging surface of the first object,

wherein said nanostructures are arranged to enhance a thermal transfer process between the first object and a second object distinct from said first object.

44. The method of claim 43 wherein said nanostructures include a plurality of nanotubes.

45. The method of claim 44 wherein said applying step includes growing said plurality of said nanotubes on said heat-exchanging surface.

46. The method of claim 44 wherein said nanotubes form a substantially continuous film.

47. The method of claim 44 wherein said nanotubes are generally aligned along a common axis.

48. The method of claim 47 wherein said common axis is oriented to be substantially normal to the surface of the object.

49. The method of claim 44 wherein said nanotubes are randomly oriented.

50. The method of claim 44 wherein said nanotubes include carbon nanotubes and/or boron nitride nanotubes.

51. The method of claim 43 wherein said nanostructures include nanorods and/or nanowires.

52. The method of claim 51 wherein said nanowires include a nanowire made of a metal.

53. The method of claim 52 wherein said metal is selected from the group consisting of indium, copper, nickel and aluminum.