Method of manufacturing a substrate for an electronic device by using etchant and electronic device having the substrate
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Accused Products
Abstract
In the case that a stacked layer, in which another metal layer is stacked on an Al layer or Al alloy layer having a low resistance, is used as a wiring material, an etchant is provided which can etch to a substantially equal etching rate by executing only one etching on the each metal layer composing the stacked layer. A method of manufacturing a substrate for an electronic device uses the etchant, producing an electronic device having the substrate.
In order to achieve the object, the etchant has fluoric acid, periodic acid and sulfuric acid wherein the total weight ratio of the fluoric acid and periodic acid is 0.05˜30 wt %, the weight ratio of the sulfuric acid is 0.05˜20 wt %, the weight ratio of periodic acid to fluoric acid is 0.01˜2 wt %. Also each layer of wiring(5,12,14) formed by stacking Al layer or Al alloy layer and Ti layer or Ti alloy layer can be uniformly etched to substantially equal etching rate by the etchant.
38 Citations
19 Claims
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1-4. -4. (canceled)
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5. A method for manufacturing a device, comprising:
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forming a stacked wiring layer on a substrate, the stacked wiring layer having a first layer and a second layer, wherein the first layer includes aluminum and the second layer includes titanium. forming a photoresist pattern on the stacked wiring layer; and
performing a single etching for the stacked wiring layer using an etchant, wherein the etched first layer has substantially the same width as the etched second layer. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 19)
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Specification