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High density contact to relaxed geometry layers

  • US 20050127519A1
  • Filed: 12/05/2003
  • Published: 06/16/2005
  • Est. Priority Date: 12/05/2003
  • Status: Active Grant
First Claim
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1. A structure for providing multilevel electrical connectivity within an integrated circuit, the structure comprising:

  • a first plurality of vias;

    a second plurality of vias, wherein the first and second pluralities of vias are vertically overlapping;

    a first routing level at a first height, said first level connected to the first plurality of vias; and

    a second routing level at a second height, said second level connected to the second plurality of vias, wherein the first height is different from the second height, wherein both routing levels are formed above the substrate, and wherein a) the first routing level and the second routing level are above the first and second vias or b) the first routing level and the second routing level are below the first and second vias.

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