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Semiconductor assembly with conductive rim and method of producing the same

  • US 20050127525A1
  • Filed: 12/15/2003
  • Published: 06/16/2005
  • Est. Priority Date: 12/15/2003
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a first wafer;

    a second wafer; and

    a conductive rim between the first and second wafers, the conductive rim electrically and mechanically connecting the first and second wafers, the conductive rim and second wafer at least in part sealing an area on the surface of the first wafer.

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