Device for removing heat from electrical equipment

• US 20050128707A1
• Filed: 12/12/2003
• Published: 06/16/2005
• Est. Priority Date: 12/12/2003
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Inventors: Lavoie, Martin D., Sanders, David K.
• Granted Patent: US 7,158,379 B2
• Time in Patent Office: Days
• US Class Current: 361/703
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components
• CPC Class Codes: Y10S 439/947 PCB mounted connector with ground terminal

Abstract

A heat removal device includes a shroud on a top side of a printed circuit board that contains a power connector. An air intake vent is located underneath the printed circuit board and directs air up through printed circuit board vias into the shroud. Openings are located in a power connector housings that allow air to flow over conductors in the connector and out an air outtake vent. The conductors include heat sink fins that extend out of the openings in the connector housing.

Claims

1. A connector, comprising:

conductors; and

a housing containing the conductors configured with an opening on at least one side other than the front connecting face for promoting air flow across the conductors in the housing.

2. A connector according to claim 1 including fins coupled to the conductors and extending out of the housing opening.

3. A connector according to claim 1 including openings on opposite sides of the housing for passing air through a first one of the openings, over the conductors, and out a second one of the openings.

4. A connector according to claim 1 including an air flow control device configured to direct air into the housing opening.

5. A connector according to claim 4 wherein the air flow device includes an air intake vent configured to direct air from underneath a circuit board up through circuit board vias and into the housing opening.

6. A connector according to claim 4 including an exhaust vent that directs air out of the air flow control device.

7. A connector according to claim 4 wherein the air flow control device includes a shroud covering the connector.

8. A connector according to claim 7 including an exhaust vent configured to vent air out of the shroud.

9. A connector according to claim 4 including vias connected to a power plane on a printed circuit board, the vias located inside the air flow control device for directing air from underneath the circuit board up through the vias and across the conductors in the connector.

10. A heat removal system, comprising:

a device configured to attach over a circuit board power connector and including an output vent for directing heat away from the power connector.

11. A heat removal system according to claim 10 including an air intake vent located on an underside of the printed circuit board for directing air up through holes in the printed circuit board and into the device.

12. A heat removal system according to claim 11 including a hinge that couples the device with the air intake vent.

13. A heat removal system according to claim 11 wherein the holes are electrically coupled to a power plane on the printed circuit board.

14. A heat removal system according to claim 10 including openings in a power connector housing, the device directing air flow into a first one of the openings, over conductors in the connector, out a second one of the openings, and out the output vent.

15. A heat removal system according to claim 14 including fins on the conductors extending out of the housing openings.

16. A heat removal system according to claim 10 including a fan located next to the air exhaust for sucking air out of the output vent.

17. An air flow control device, comprising:

a unit for containing a circuit board power connector;

an air intake vent for directing air into the unit; and

an air outtake vent for directing air out of the unit.

18. An air flow control device according to claim 18 including openings on opposite sides of the power connector.

19. An air flow control device according to claim 18 including heat sink fins thermally coupled to conductors in the power connector and extending out of the openings.

20. An air flow control device according to claim 19 including circuit board vias located inside the unit and coupled to a circuit board power plane.