Plating using copolymer

• US 20050130078A1
• Filed: 12/10/2003
• Published: 06/16/2005
• Est. Priority Date: 12/10/2003
• Status: Active Grant

• Current Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Original Assignee: Hitachi Global Storage Technologies Incorporated (Western Digital Corporation)
• Inventors: Ramasubramanian, Murali, Breyta, Gregory, Wang, Benjamin L., Bedell, Daniel W., Harris, Tom K. III, Hixson-Goldsmith, April D., Renaldo, Alfred
• Granted Patent: US 7,534,555 B2
• Time in Patent Office: Days
• US Class Current: 430/324
• CPC Class Codes: C09D 125/18 Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
• CPC Class Codes: G03F 7/085 Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives G03F7/075 takes precedence
• CPC Class Codes: G03F 7/094 Multilayer resist systems, e.g. planarising layers
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence

Abstract

Method of plating using a polymeric barrier layer including a polyphenolic polymer which has a repeating unit of the formula:
wherein R₁, R₂, R₃, R₄, and R₅ are individually hydrogen, a hydroxy group or an azo dye.

Claims

1. A method for plating, comprising:

coating a substrate with a barrier layer, wherein the barrier layer comprises an adhesive composition comprising a polyphenolic polymer, said polyphenolic polymer comprising repeating monomeric units having the formula;

wherein each of R₁, R₂, R₃, R₄, and R₅ are each individually a hydroxy group, hydrogen, or an azo dye moiety;

coating the barrier layer with a top layer comprising a photoresist;

imagewise exposing the top layer to radiation;

removing the exposed portion of the top layer for exposing a portion of the barrier layer;

removing the exposed portion of the barrier layer for exposing a portion of the substrate; and

plating a material on the exposed portion of the substrate.

2. A method as recited in claim 1, wherein the substrate includes a seed layer, the barrier layer being formed on the seed layer.

3. A method as recited in claim 1, wherein the barrier layer comprises 100% of the polyphenolic polymer.

4. A method as recited in claim 1, wherein the barrier layer is spin coated on the substrate.

5. A method as recited in claim 1, wherein the barrier layer is substantially formed in a monolayer.

6. A method as recited in claim 1, wherein only one of R₁, R₂, R₃, R₄, and R₅ is hydroxyl.

7. A method as recited in claim 1, wherein the exposed portion of the top layer is removed using a developer.

8. A method as recited in claim 7, wherein the developer also removes the exposed portion of the barrier layer.

9. A method as recited in claim 7, wherein the developer does not remove the exposed portion of the barrier layer.

10. A method as recited in claim 9, wherein the exposed portion of the barrier layer is removed by reactive ion etching.

11. A method as recited in claim 9, wherein the exposed portion of the barrier layer is removed by milling.

12. A method as recited in claim 1, wherein removal of the exposed portion of the barrier layer does not create undercuts under the photoresist.

13. A method as recited in claim 1, wherein removal of the exposed portion of the barrier layer creates undercuts under the photoresist.

14. A method as recited in claim 1, wherein the barrier layer also functions as an antireflective coating.

29. A magnetic storage system, comprising:

magnetic media;

at least one head for reading from and writing to the magnetic media, each head having;

a write head portion; and

a read head portion coupled to the write head portion;

wherein a portion of at least one of the read head portion and the write portion is formed by the method of claim 1;

a slider for supporting the head; and

a control unit coupled to the head for controlling operation of the head.

15. A method for plating, comprising:

coating a substrate with a barrier layer, wherein the barrier layer comprises an adhesive composition comprising a polyphenolic polymer, said polyphenolic polymer comprising repeating monomeric units having the formula;

wherein each of R₁, R₃, R₄, and R₅ are each individually a hydroxy group, hydrogen, or an substituted azo group and R₆ is a methylene or substituted methylene group;

coating the barrier layer with a top layer comprising a photoresist;

imagewise exposing the top layer to radiation;

removing the exposed portion of the top layer for exposing a portion of the barrier layer;

removing the exposed portion of the barrier layer for exposing a portion of the substrate; and

plating a material on the exposed portion of the substrate.

16. A method as recited in claim 15, wherein the substrate includes a seed layer, the barrier layer being formed on the seed layer.

17. A method as recited in claim 15, wherein the barrier layer comprises 100% of the polyphenolic polymer.

18. A method as recited in claim 15, wherein the barrier layer is spin coated on the substrate.

19. A method as recited in claim 15, wherein the barrier layer is substantially formed in a monolayer.

20. A method as recited in claim 15, wherein only one of R₁, R₃, R₄, and R₅ is hydroxyl.

21. A method as recited in claim 15, wherein the exposed portion of the top layer is removed using a developer.

22. A method as recited in claim 21, wherein the developer also removes the exposed portion of the barrier layer.

23. A method as recited in claim 21, wherein the developer does not remove the exposed portion of the barrier layer.

24. A method as recited in claim 23, wherein the exposed portion of the barrier layer is removed by reactive ion etching.

25. A method as recited in claim 23, wherein the exposed portion of the barrier layer is removed by milling.

26. A method as recited in claim 15, wherein removal of the exposed portion of the barrier layer does not create undercuts under the photoresist.

27. A method as recited in claim 15, wherein removal of the exposed portion of the barrier layer creates undercuts under the photoresist.

28. A method as recited in claim 15, wherein the barrier layer also functions as an antireflective coating.

30. An adhesive composition, comprising:

an adhesive composition comprising a polyphenolic polymer, the polyphenolic polymer comprising repeating monomeric units having the formula;

wherein each of R₁, R₃, R₄, and R₅ are each individually a hydroxy group, hydrogen, or a substituted azo group and R₆ is a methylene or substituted methylene group.

31. An adhesive composition as recited in claim 30, wherein only one of R₁, R₃,R₄, and R₅ is hydroxyl.

32. An adhesive composition as recited in claim 30, wherein the polymer comprises second repeating units which are different.

33. An adhesive composition as recited in claim 30, wherein the polymer comprises first and second repeating units which are monoazo dyes.

34. An adhesive composition as recited in claim 33, wherein the monoazo dye has the formula:

35. An adhesive composition as recited in claim 34, wherein the monoazo dye has the formula: