Apparatus and method for depositing materials onto microelectronic workpieces
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Abstract
Reactors for vapor deposition of materials onto a microelectronic workpiece, systems that include such reactors, and methods for depositing materials onto microelectronic workpieces. In one embodiment, a reactor for vapor deposition of a material comprises a reaction chamber and a gas distributor. The reaction chamber can include an inlet and an outlet. The gas distributor is positioned in the reaction chamber. The gas distributor has a compartment coupled to the inlet to receive a gas flow and a distributor plate including a first surface facing the compartment, a second surface facing the reaction chamber, and a plurality of passageways. The passageways extend through the distributor plate from the first surface to the second surface. Additionally, at least one of the passageways has at least a partially occluded flow path through the plate. For example, the occluded passageway can be canted at an oblique angle relative to the first surface of the distributor plate so that gas flowing through the canted passageway changes direction as it passes through the distributor plate.
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Citations
30 Claims
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1-15. -15. (canceled)
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16. A reactor for vapor deposition of a material onto a microelectronic workpiece, comprising:
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a reaction chamber having an inlet and an outlet; and
a gas distributor in the reaction chamber, the gas distributor having a plenum through which gas can flow along a flow path, the plenum having a distributor plate transverse to the flow path, and the distributor plate having a plurality of passageways extending through the plate, the passageways including first passageways having a first physical parameter and extending through the plate at an oblique angle relative to a plane defined by the plate and second passageways having a second physical parameter different than the first physical parameter, and wherein the first passageways are in an inner region of the plate and the second passageways are in an outer region of the plate. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A reactor for vapor deposition of a material onto a microelectronic workpiece, comprising:
a reaction chamber having an inlet and an outlet; and
a gas distributor in the reaction chamber that is coupled to the inlet, the gas distributor comprising a plenum having a single compartment through which gas can flow and a distributor plate, the distributor plate having a first surface facing the compartment, a second surface facing away from the compartment, and a plurality of passageways extending from the first surface to the second surface, wherein the passageways include first passageways located at a central portion of the distributor plate that extend at an oblique angle relative to the first surface of the distributor plate and second passageways located in an outer region of the distributor plate that have a physical characteristic different from the first passageways.- View Dependent Claims (24, 25, 26, 27, 28, 29)
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30-72. -72. (canceled)
Specification