Printed wiring board and semiconductor device
First Claim
1. A printed wiring board having a large number of wirings formed substantially parallel to one another, a dummy pattern formed along the wirings and a solder resist layer formed by coating the wirings and the dummy pattern with a solder resist, the coating thickness of said solder resist being gradually decreased toward the edge, wherein:
- the dummy pattern has a solder resist coating thickness control area.
1 Assignment
0 Petitions
Accused Products
Abstract
A printed wiring board has a large number of wirings formed substantially parallel to one another, a dummy pattern is formed along the wirings and a solder resist layer is formed by coating the wirings and the dummy pattern with a solder resist. The coating thickness of said solder resist gradually decreases toward the edge, wherein the dummy pattern has a solder resist coating thickness control area. A semiconductor device includes the above-mentioned printed wiring board with an electronic part mounted thereon. Accordingly, a slope uniformly extending over the whole width of the solder resist layer is formed at the edge portion of the solder resist layer to improve electrical connectivity.
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Citations
8 Claims
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1. A printed wiring board having a large number of wirings formed substantially parallel to one another, a dummy pattern formed along the wirings and a solder resist layer formed by coating the wirings and the dummy pattern with a solder resist, the coating thickness of said solder resist being gradually decreased toward the edge, wherein:
the dummy pattern has a solder resist coating thickness control area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
Specification