Electrical urea biosensors and its manufacturing method

• US 20050133367A1
• Filed: 12/19/2003
• Published: 06/23/2005
• Est. Priority Date: 12/19/2003
• Status: Abandoned Application

• Current Assignee: Chung-Yuan Christian University, Megawin Technology Co., Ltd.
• Original Assignee: Chung-Yuan Christian University, Megawin Technology Co., Ltd.
• Inventors: Hsiung, Shen Kan, Pan, Chung We, Chen, Jia-Chyi, Sun, Tai Ping, Chou, Jung Chuan
• Application Number:
  US10/739,159
• Publication Number:
  US 20050133367A1
• Time in Patent Office: Days
• US Class Current: 204/403.100
• CPC Class Codes: C12Q 1/005 involving specific analytes or enzymes including groups of enzymes, e.g. oxydases; C12Q1/004 takes precedence
• CPC Class Codes: G01N 27/4145 specially adapted for biomolecules, e.g. gate electrode with immobilised receptors
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The present invention is to provide an electrical urea biosensor and its manufacturing method. In the present invention, a sensitive film is positioned on a surface of a substrate, wherein a conductive layer is formed on the surface of the substrate. The sensitive film is used as an ion-sensitive electrode. The sensitive film provides with a sensitive region and a non-sensitive region. A conductive line is extended from the conductive layer for using as an external electrical contact point. The present invention utilizes a package encapsulant covering the non-sensitive region of the sensitive film to define a sensitive window at the sensitive region and a urea enzyme is immobilized within the sensitive window of the sensitive film. Then, the present invention completes the formulation of a urea biosensor. The present invention is a disposable urea biosensor and provides with advantages of the mass production, low cost, and the easy package.

Claims

1. An electrical urea biosensor comprising:

a substrate, wherein a conductive layer is formed on a surface of said substrate;

a sensitive film positioned on a surface of said conductive layer of said substrate for using as an ion-sensitive electrode, wherein said sensitive film provides with a sensitive region and a non-sensitive region;

a conductive line extended from said conductive layer for using as an external electrical contact point;

a package encapsulant covering said non-sensitive region of said sensitive film to define a sensitive window at the sensitive region; and

an urea enzyme immobilized within said sensitive window of said sensitive film.

2. The electrical urea biosensor according to claim 1, wherein said substrate is selected from the group of an isolation substrate and a non-isolation substrate.

3. The electrical urea biosensor according to claim 2, wherein said isolation substrate is selected from the group of a silicon substrate, a glass substrate, a ceramics substrate, and a polymer substrate.

4. The electrical urea biosensor according to claim 1, wherein said conductive layer is made of the indium tin oxide (ITO).

5. The electrical urea biosensor according to claim 1, wherein said sensitive film is a non-isolation solid-state ion-sensitive film.

6. The electrical urea biosensor according to claim 1, wherein said sensitive film is made of the tin oxide.

7. The electrical urea biosensor according to claim 1, wherein said sensitive film is formed by the sputtering method.

8. The electrical urea biosensor according to claim 1, wherein said conductive line provides a connection to a high input impedance potentiometer.

9. The electrical urea biosensor according to claim 1, wherein said urea enzyme is immobilized within said sensitive window of said sensitive film by using a enzyme immobilized technology.

10. The electrical urea biosensor according to claim 1, wherein said urea enzyme is composed of urease, which is embedded by a PVA-SbQ encapsulant.

11. A manufacturing method for an electrical urea biosensor, said manufacturing method comprising following steps:

providing a substrate, wherein a conductive layer is formed on a surface of said substrate;

forming a sensitive film on a surface of said conductive layer of said substrate for using as an ion-sensitive electrode, wherein said sensitive film provides with a sensitive region and a non-sensitive region;

forming a conductive line extended from said conductive layer for using as an external electrical contact point;

performing a package step by utilizing a package encapsulant to cover said non-sensitive region of said sensitive film so as to define a sensitive window at the sensitive region; and

utilizing an enzyme immobilized technology to immobilize an urea enzyme within said sensitive window of said sensitive film.

12. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said substrate is selected from the group of an isolation substrate and a non-isolation substrate.

13. The manufacturing method for the electrical urea biosensor according to claim 12, wherein said isolation substrate is selected from the group of a silicon substrate, a glass substrate, a ceramics substrate, and a polymer substrate.

14. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said conductive layer is made of the indium tin oxide (ITO).

15. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said sensitive film is a non-isolation solid-state ion-sensitive film.

16. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said sensitive film is made of the tin oxide.

17. The manufacturing method for the electrical urea biosensor for the electrical urea biosensor according to claim 11, wherein said sensitive film is formed by the sputtering method.

18. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said urea enzyme is immobilized within said sensitive window of said sensitive film by a physics embedding method.

19. The manufacturing method for the electrical urea biosensor according to claim 11, wherein said urea enzyme is composed of urease, which is embedded by a PVA-SbQ encapsulant.