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Component packaging apparatus, systems, and methods

  • US 20050133909A1
  • Filed: 12/18/2003
  • Published: 06/23/2005
  • Est. Priority Date: 12/18/2003
  • Status: Abandoned Application
First Claim
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1. An apparatus, including:

  • a die having at least one scalable component of a circuit; and

    a structure having at least one non-scalable component of the circuit, wherein the die does not include another non-scalable component of the circuit.

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