MICROENCAPSULATED ELECTROPHORETIC DISPLAY WITH INTEGRATED DRIVER

• US 20050134554A1
• Filed: 02/03/2005
• Published: 06/23/2005
• Est. Priority Date: 07/27/2001
• Status: Active Grant

• Current Assignee: E Ink Holdings Incorporated
• Original Assignee: E Ink Holdings Incorporated
• Inventors: Albert, Jonathan D., Gates, Holly G.
• Granted Patent: US 7,382,363 B2
• Time in Patent Office: Days
• US Class Current: 345/107
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 1/16753 Structures for supporting or mounting cells, e.g. frames or bezels
• CPC Class Codes: G09G 3/16 by control of light from an independent source
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

A mounted display assembly comprises a flexible substrate that supports both display elements and control circuits. The display assembly generally comprises: an electrical connection formed on the flexible substrate, the electrical connection having first and second contact pads; a display element in electrical communication with the first contact pad; and a control circuit mounted on the flexible substrate and in electrical communication with the second contact pad. In a preferred embodiment, the display element comprises a microencapsulated electrophoretic display medium. In another preferred embodiment, printing processes are employed in manufacturing methods for the display assembly

Claims

1. A method of manufacturing an electrophoretic display assembly, comprising the steps of:

providing a flexible substrate;

forming upon said substrate an electrical connection having a first contact pad and a second contact pad spaced from one another;

mounting upon said substrate a control circuit in electrical communication with said second contact pad; and

providing an electrophoretic display element in electrical communication with said first contact pad.

2. The method of claim 1, wherein the step of forming upon said substrate an electrical connection comprises a printing process.

3. The method of claim 1, wherein the step of providing an electrophoretic display element comprises a printing process.

4. The method of claim 1, wherein said control circuit is connected to said second contact pad with a curable, electrically conductive resin.

5. The method of claim 1, wherein said control circuit is connected to said second contact pad with an electrically conductive ink.

6. The method of claim 1, wherein said control circuit is connected to said second contact pad with an electrically conductive paint.

7. The method of claim 1, wherein said control circuit is connected to said second contact pad by being removably mounted in a control circuit carrier that is in electrical communication with said second contact pad.

8. The method of claim 1, wherein said control circuit comprises an electrophoretic display driver chip.

9. A method of manufacturing an electrophoretic display assembly, comprising the steps of:

providing a first flexible substrate;

forming upon said first flexible substrate an electrical connection having a first contact pad and a second contact pad separated from each other;

mounting on said first flexible substrate a control circuit in electrical communication with said second contact pad;

providing a second flexible substrate;

disposing upon said second flexible substrate an electrophoretic display element; and

disposing said first flexible substrate adjacent said second flexible substrate so that said first contact pad addresses said electrophoretic display element.

10. The method of claim 9, wherein the step of disposing upon said second flexible substrate an electrophoretic display element comprises a printing process.

11. The method of claim 9, wherein the step of disposing said first flexible substrate adjacent said second flexible substrate further comprises a laminating process.

12. The method of claim 9, wherein said control circuit is connected to said second contact pad with a curable, electrically conductive resin.

13. The method of claim 9, wherein said control circuit is connected to said second contact pad with an electrically conductive ink.

14. The method of claim 9, wherein said control circuit is connected to said second contact pad with an electrically conductive paint.

15. The method of claim 9, wherein said control circuit is connected to said second contact pad by being removably mounted in a control circuit carrier that is in electrical communication with said second contact pad.

16. The method of claim 9, wherein said control circuit comprises an electrophoretic display driver chip.