Plastic lead frames utilizing reel-to-reel processing

• US 20050136569A1
• Filed: 12/18/2003
• Published: 06/23/2005
• Est. Priority Date: 12/18/2003
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Shiffer, Stephen R., Figi, Bruce B., Abramowski, Jerry
• Granted Patent: US 7,134,197 B2
• Time in Patent Office: Days
• US Class Current: 438/107
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

Reel-to-reel manufacturing methods and systems are disclosed herein. In general, one or more plastic parts (e.g., plastic substrate) can be transported on a carrier for manufacturing of a final product based initially on the part or substrate. A reel-to-reel mechanism is provided comprising one or more reels associated with the carrier, such that the part can be spooled and unspoiled upon the one or more of the reels prior and subsequent to a performance of a manufacturing operation upon the part for the purpose of creating an electronic circuit. A plurality of manufacturing operations can then be subsequently upon the part utilizing the reel-to-reel mechanism to create a final electronic system based upon the part initially subject to the manufacturing operations.

Claims

14. A manufacturing method, comprising:

providing a reel-to-reel mechanism that includes at least one reel, wherein said at least one reel is associated with a carrier, such that at least one plastic substrate can be spooled and unspoiled upon said at least one reel prior and subsequent to a performance of a plurality of manufacturing operations upon said at least one plastic substrate, wherein said at least one reel of said reel-to-reel mechanism comprises a plurality of reels for spooling and spooling said at least one plastic substrate upon said carrier;

subsequently implementing upon said at least one plastic substrate, said plurality of manufacturing operations, including at least one plastic molding operation and at least one plating operation utilizing said reel-to-reel mechanism to create said final plastic-based product based initially upon said at least one plastic substrate for the creation of electronic circuitry thereof; and

implementing a photo-circuit layout operation for transferring a circuit pattern required to configure said plastic circuitry upon said at least one plastic substrate for the creation of an electronics package thereon.

15. A system, comprising:

a reel-to-reel mechanism that includes at least one reel, wherein said at least one reel is associated with a carrier, such that at least one plastic substrate can be spooled and unspoiled upon said at least one reel prior and subsequent to a performance of a plurality of manufacturing operations upon said at least one plastic substrate; and

wherein said plurality of manufacturing operations can be subsequently implementing upon said at least one plastic substrate, including at least one plastic molding operation and at least one circuit configuring operation utilizing said reel-to-reel mechanism to create said final plastic-based product based initially upon said at least one plastic substrate for the creation of electronic circuitry thereof.

1. A manufacturing method, comprising:

providing a reel-to-reel mechanism that includes at least one reel, wherein said at least one reel is associated with a carrier, such that at least one plastic substrate can be spooled and unspoiled upon said at least one reel prior and subsequent to a performance of a plurality of manufacturing operations upon said at least one plastic substrate; and

subsequently implementing upon said at least one plastic substrate, said plurality of manufacturing operations, including at least one plastic molding operation and at least one circuit configuring operation utilizing said reel-to-reel mechanism to create said final plastic-based product based initially upon said at least one plastic substrate for the creation of electronic circuitry thereof.

2. The method of claim 1 wherein said at least one circuit configuring operation comprises a plating operation for constructing electronic conductors upon said at least one plastic substrate for the creation of electronic circuitry thereof.

3. The method of claim 1 wherein said at least one circuit configuring operation comprises a sputtering operation for constructing conduction circuitry upon said at least one plastic substrate for the creation of electronic circuitry thereof.

4. The method of claim 1 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a component placement operation for placing components upon said at least one plastic substrate;

a soldering operation for soldering said components;

a bonding operation for bonding said components; and

an overmolding operation.

5. The method of claim 1 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a package sealing operation for sealing said electronics package;

an insertion operation for inserting additional components into said electronics package;

a welding operation for welding said components; and

a painting operation.

6. The method of claim 1 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a plating operation for plating said components to provide conduction thereof upon said at least one substrate;

a testing operation for testing said electronics package;

a shipping operation for shipping said electronics package; and

an assembly packaging operation.

7. The method of claim 1 wherein said carrier comprises a material, which permits a transportation of a plurality of plastic substrates for the creation of electronics packages thereon.

8. The method of claim 1 wherein said at least one reel of said reel-to-reel mechanism comprises a plurality of reels for spooling and spooling said at least one plastic substrate upon said carrier.

9. The method of claim 1 further comprising implementing a layout operation for transferring a circuit pattern required to configure said plastic circuitry upon said at least one plastic substrate for the creation of an electronics package thereon.

10. The method of claim 9 wherein said layout operation comprises a photo-circuit layout operation.

11. The method of claim 1 wherein said at least one plastic molding operation comprises a utilization of a plurality of molds for the creation of said electronic circuitry thereof.

12. The method of claim 1 further comprising manipulating said at least one plastic substrate, including units thereof, for enhancing manufacturing efficiency.

13. The method of claim 1 wherein said at least one plastic substrate comprises a resin which permits circuitry to be constructed thereupon.

16. The system of claim 15 wherein said at least one circuit configuring operation comprises a plating operation for constructing electronic conductors upon said at least one plastic substrate for the creation of electronic circuitry thereof.

17. The system of claim 15 wherein said at least one circuit configuring operation comprises a sputtering operation for constructing conduction circuitry upon said at least one plastic substrate for the creation of electronic circuitry thereof.

18. The system of claim 15 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a component placement operation for placing components upon said at least one plastic substrate;

a soldering operation for soldering said components;

a bonding operation for bonding said components; and

an overmolding operation.

19. The system of claim 15 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a plating operation for plating said components to provide conduction thereof upon said at least one substrate;

a testing operation for testing said electronics package;

a shipping operation for shipping said electronics package; and

an assembly packaging operation.

20. The system of claim 15 further comprising a photo-circuit layout module for transferring a pattern required to configure said plastic circuitry upon said at least one plastic substrate for the creation of an electronics package thereon.

18-1. The system of claim 15 wherein said plurality of manufacturing operations further comprises at least one of the following manufacturing operations for building an electronics package upon said at least one plastic substrate:

a package sealing operation for sealing said electronics package;

an insertion operation for inserting additional components into said electronics package;

a welding operation for welding said components; and

a painting operation.