Lithographic apparatus, method of calibration, calibration plate, device manufacturing method, and device manufactured thereby

• US 20050138988A1
• Filed: 12/29/2003
• Published: 06/30/2005
• Est. Priority Date: 12/29/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Anicetus Bruinsma, Anastasius Jacobus, Margaretha Dekkers-Rog, Petra Albertina, Levasier, Leon Martin, Nijmeijer, Gerrit Johannes, Klinkhamer, Jacob Fredrik Friso
• Granted Patent: US 6,955,074 B2
• Time in Patent Office: Days
• US Class Current: 73/1.810
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/7085 Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• CPC Class Codes: G03F 9/7019 Calibration
• CPC Class Codes: G03F 9/7034 Leveling
• CPC Class Codes: Y10T 29/49771 Quantitative measuring or gauging

Abstract

A method according to one embodiment of the invention may be performed using a calibration plate having at least one alignment marker and at least one height profile. First, the calibration plate is positioned using an alignment sensor. Then the height profile is measured by a height sensor. Then the calibration plate is rotated by substantially 180 degrees and the two operations are repeated. This procedure results in two measured height profiles, which are compared in order to find a best fit. The amount of shift performed to find the best fit is used to determine a distance between the alignment marker and the X,Y position of the measurement point of the height sensor.

Claims

1. A method of calibration, said method comprising:

moving a marker of a calibration plate to an alignment position;

using a height sensor to measure a first height profile of the calibration plate;

subsequent to said moving a marker and said using a height sensor to measure a first height profile, rotating the calibration plate by substantially 180 degrees;

subsequent to said rotating, moving the marker to the alignment position again;

subsequent to said rotating, using the height sensor to measure a second height profile of the calibration plate; and

determining a position of a measurement spot of the height sensor with respect to the alignment position, based on the first and second height profiles.

2. The method of calibration according to claim 1, wherein the first height profile includes a first measurement of a feature of the calibration plate, and

wherein the first height profile includes a second measurement of the feature of the calibration plate, and

wherein said determining a position of a measurement spot of the height sensor is based on the first and second measurements.

3. The method of calibration according to claim 2, wherein said determining a position of a measurement spot of the height sensor is based on a difference between the first and second measurements.

4. The method of calibration according to claim 2, wherein the feature includes an intersection of two planes, the planes being sloped with respect to each other.

5. The method of calibration according to claim 1, wherein at least one among the first and second height profiles includes measurements of a first plane of the calibration plate and measurements of a second plane of the calibration plate that is sloped with respect to the first plane.

6. The method of calibration according to claim 1, said method further comprising:

subsequent to said using the height sensor to measure a second height profile, further rotating the calibration plate by one among substantially 90 degrees and substantially 270 degrees, and

subsequent to said further rotating, using the height sensor to measure a third height profile of the calibration plate.

7. The method of calibration according to claim 6, wherein said determining a position of a measurement spot of the height sensor is based on the third height profile.

8. The method of calibration according to claim 1, wherein at least one among the first and second height profiles includes measurements of a successive plurality of planes of the calibration plate, each among the successive plurality of planes having a different slope than an adjacent one among the successive plurality of planes.

9. The method of calibration according to claim 1, said method further comprising determining a best-fit alignment of one among the first and second height profiles and a reversed version of the other among the first and second height profiles,

wherein said determining a best-fit alignment includes determining a relative displacement of the one profile and the reversed version of the other profile corresponding to the alignment.

10. The method of calibration according to claim 9, wherein said determining a position of a measurement spot of the height sensor is based on said relative displacement.

11. The method of calibration according to claim 9, wherein said determining a best-fit alignment includes calculating, for each of a plurality of relative displacements between the one profile and the reversed version of the other profile, a corresponding difference between the one profile and the reversed version of the other profile.

12. The method of calibration according to claim 9, wherein said determining a best-fit alignment includes applying a method of least-squares.

13. The method of calibration according to claim 1, said method further comprising:

prior to said rotating, using the height sensor to measure a first height profile of a reference area of the calibration plate; and

subsequent to said rotating, using the height sensor to measure a second height profile of a reference area of the calibration plate,

wherein said determining a position of a measurement spot of the height sensor is based on at least one among the first and second height profiles of the reference area.

14. The method of calibration according to claim 13, said method further comprising, prior to said determining a position of a measurement spot of the height sensor, modifying at least one of the first and second height profiles according to at least one among the first and second height profiles of the reference area.

15. The method of calibration according to claim 1, said method further comprising providing a wafer that contains the calibration plate.

16. The method of calibration according to claim 1, said method further comprising arranging the calibration plate on a substrate table.

17. The method of calibration according to claim 1, said method further comprising projecting a patterned beam of radiation onto a target portion of a radiation-sensitive material that at least partially covers a substrate,

wherein said projecting is based on said determining a position of a measurement spot of the height sensor.

18. The method of calibration according to claim 17, wherein said projecting includes measuring a height of the substrate, and

wherein said measuring a height of the substrate is based on said determining a position of a measurement spot of the height sensor.

19. The method of calibration according to claim 17, wherein said projecting includes positioning the substrate, and

wherein said positioning is based on said determining a position of a measurement spot of the height sensor.

20. The method of calibration according to claim 19, wherein said positioning includes rotating the substrate around an axis parallel to a surface of the substrate, and

wherein said rotating the substrate is based on said determining a position of a measurement spot of the height sensor.

21. A device manufactured according to the method according to claim 17.

22. The method of calibration according to claim 1, wherein said moving a marker includes moving a substrate table of a lithographic apparatus.

23. The method of calibration according to claim 22, wherein said rotating the calibration plate includes removing the calibration plate from the substrate table.

24. A calibration plate comprising:

an alignment marker;

a first plane; and

a second plane sloped with respect to the first plane.

25. The calibration plate according to claim 24, wherein the calibration plate is arranged on a wafer.

26. The calibration plate according to claim 24, wherein the calibration plate includes a plurality of planes, each plane being sloped with respect to at least two other planes.

27. The calibration plate according to claim 24, wherein the calibration plate includes a plurality of alignment markers.

28. A device manufacturing method, said method comprising:

moving a marker of a calibration plate to an alignment position;

using a height sensor to measure a first height profile of the calibration plate;

subsequent to said moving a marker and said using a height sensor to measure a first height profile, rotating the calibration plate by substantially 180 degrees;

subsequent to said rotating, moving the marker to the alignment position again;

subsequent to said rotating, using the height sensor to measure a second height profile of the calibration plate;

determining a position of a measurement spot of the height sensor with respect to the alignment position, based on the first and second height profiles;

using a radiation system to provide a beam of radiation;

using a patterning structure to pattern the beam of radiation according to a desired pattern; and

projecting the patterned beam onto a target portion of a layer of radiation-sensitive material that at least partially covers a substrate,

wherein said projecting includes positioning the substrate based on said determining a position of the measurement spot of the height sensor.

29. The device manufacturing method according to claim 28, wherein said positioning includes measuring a height of the substrate, based on said determining a position of the measurement spot of the height sensor.

30. The device manufacturing method according to claim 29, wherein said positioning includes rotating the substrate around an axis parallel to a surface of the substrate, and

wherein said rotating the substrate is based on said determining a position of a measurement spot of the height sensor.

31. A method of calibration, said method comprising:

providing a calibration plate having at least one alignment marker;

positioning the calibration plate in a lithographic apparatus using an alignment sensor, such that the alignment marker is in a first X,Y position and a measurement point of a height sensor of the lithographic apparatus corresponds to a second X,Y position;

measuring a first height profile of the calibration plate using the height sensor;

rotating the calibration plate by substantially 180 degrees;

subsequent to said rotating, positioning the calibration plate in the lithographic apparatus using the alignment sensor, such that the alignment marker is in the first X,Y position and the measurement point of the height sensor corresponds to the second X,Y position;

subsequent to said rotating, measuring a second height profile of the calibration plate using the height sensor;

calculating a difference between the first and second X,Y positions based on the first and second height profiles; and

calibrating the height sensor based on the difference.