×

Direct contact power transfer pad and method of making same

  • US 20050139383A1
  • Filed: 09/20/2004
  • Published: 06/30/2005
  • Est. Priority Date: 09/19/2003
  • Status: Active Grant
First Claim
Patent Images

1. A power transfer pad, comprising:

  • a non-conductive board having a top and a bottom;

    a plurality of conductive substrate sections disposed across the top of the non-conductive board;

    at least one conducting element disposed on each of the conductive substrate sections;

    a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×