Direct contact power transfer pad and method of making same
First Claim
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1. A power transfer pad, comprising:
- a non-conductive board having a top and a bottom;
a plurality of conductive substrate sections disposed across the top of the non-conductive board;
at least one conducting element disposed on each of the conductive substrate sections;
a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
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Abstract
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
18 Citations
57 Claims
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1. A power transfer pad, comprising:
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a non-conductive board having a top and a bottom;
a plurality of conductive substrate sections disposed across the top of the non-conductive board;
at least one conducting element disposed on each of the conductive substrate sections;
a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of manufacturing a power transfer pad, comprising:
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depositing a first patterned solder mask onto conductive substrates disposed on the top and bottom of a non-conductive board;
adding conductive material to regions of the conductive substrates not covered by the first patterned solder mask to form raised conducting elements on the conductive substrates;
removing the first patterned solder mask;
depositing a second patterned solder mask onto the conductive substrates, the second patterned solder mask covering the raised conducting elements and also covering regions of the conductive substrates;
removing regions of the conductive substrates not covered by the second patterned solder mask, thereby separating the conductive substrates into isolated sections on the non-conductive board;
removing the second patterned solder mask; and
depositing a non-conductive material across the conductive substrates such that the raised conducting elements protrude through the non-conductive material and such that the conductive substrates are covered by the non-conductive material, and wherein the non-conductive material isolates individual sections of the conductive substrates from one another. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. A method of manufacturing a power transfer pad, comprising:
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providing a non-conductive board having a top and a bottom;
forming a plurality of conductive substrate sections across the top of the non-conductive board;
forming at least one conducting element disposed on each of the conductive substrate sections;
forming a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board. - View Dependent Claims (55, 56, 57)
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Specification