Capacitor pair structure for increasing the match thereof

• US 20050139885A1
• Filed: 10/14/2004
• Published: 06/30/2005
• Est. Priority Date: 12/31/2003
• Status: Active Grant

• Current Assignee: VIA Technologies Incorporated (VIA Technologies)
• Original Assignee: VIA Technologies Incorporated (VIA Technologies)
• Inventors: Liu, Chih-Min
• Granted Patent: US 7,417,275 B2
• Time in Patent Office: Days
• US Class Current: 257/296
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5225 Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 28/60 Electrodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A capacitor pair structure for increasing the match thereof has two finger electrode structures interlacing with each other in parallel and a common electrode being between the two finger electrode structures to form a capacitor pair structure with an appropriate ratio. Also, the capacitor pair structure could further increase its entire capacitance through vias connecting the same capacitor pair structures on different metal layers.

Claims

1. A capacitor pair structure for increasing the match thereof, said capacitor pair structure comprising:

a first finger electrode structure having a first electrode and a plurality of first extended electrodes, said plurality of first extended electrodes paralleling to each other and connecting to said first electrode;

a second finger electrode structure having a second electrode and a plurality of second extended electrodes, said plurality of second extended electrodes paralleling to each other and connecting to said second electrode, wherein said second finger electrode structure interlaces with said first finger electrode structure to form an interlaced finger electrode structure; and

a third electrode structure zigzagging between said interlaced finger electrode structure formed by said first finger electrode structure and said second finger electrode structure.

2. The capacitor pair structure according to claim 1, wherein said third electrode structure equidistantly zigzags between said interlaced finger electrode structure formed by said first finger electrode structure and said second finger electrode structure.

3. The capacitor pair structure according to claim 1, wherein said plurality of first extended electrodes vertically connect to said first electrode, said plurality of second extended electrodes vertically connect to said second electrode.

4. The capacitor pair structure according to claim 1, further comprising a guard dummy structure, said guard dummy structure surrounds said first finger electrode structure, said second finger electrode structure, and said third electrode structure.

5. The capacitor pair structure according to claim 1, wherein said first finger electrode structure could connect to another first finger electrode structure on another conductive layer by a plurality of first vias, said second finger electrode structure could connect to another second finger electrode structure on another conductive layer by a plurality of second vias, said third electrode structure could connect to another third electrode structure on another conductive layer by a plurality of third vias.

6. A capacitor pair structure for increasing the match thereof, said capacitor pair structure comprising:

a first finger electrode structure having a first electrode and a plurality of first extended electrodes, said plurality of first extended electrodes paralleling to each other and connecting to said first electrode;

a second finger electrode structure having a second electrode and a plurality of second extended electrodes, said plurality of second extended electrodes paralleling to each other and connecting to said second electrode, wherein said second finger electrode structure interlaces with said first finger electrode structure; and

a third electrode structure having a plurality of third electrodes respectively interlacing between said first finger electrode structure and said second finger electrode structure.

7. The capacitor pair structure according to claim 6, further comprising a fourth electrode, wherein said fourth electrode connects to said plurality of third electrodes by a plurality of third vias.

8. The capacitor pair structure according to claim 6, wherein said plurality of first extended electrodes are equidistant to each other, said plurality of second extended electrodes are equidistant to each other, said plurality of third electrodes are equidistant to each other.

9. The capacitor pair structure according to claim 6, wherein said plurality of first extended electrodes vertically connect to said first electrode, said plurality of second extended electrodes vertically connect to said second electrode.

10. The capacitor pair structure according to claim 6, wherein said plurality of third electrodes respectively equidistantly interlaces between said first finger electrode structure and said second finger electrode structure.

11. The capacitor pair structure according to claim 6, when said plurality of first extended electrodes are shorter than said plurality of second extended electrodes, a plurality of dummy extended electrodes are utilized to compensate lengths of said plurality of first extended electrodes, said plurality of dummy extended electrodes do not connect to said plurality of first extended electrodes.

12. The capacitor pair structure according to claim 6, further comprising a guard dummy structure, wherein said guard dummy structure surrounds said first finger electrode structure, said second finger electrode structure, and said third electrode structure.

13. The capacitor pair structure according to claim 6, wherein said first finger electrode structure could connect to another first finger electrode structure on another conductive layer by a plurality of first vias, said second finger electrode structure could connect to another second finger electrode structure on another conductive layer by a plurality of second vias, said third electrode structure could connect to another third electrode structure on another conductive layer by a plurality of third vias.

14. A capacitor pair structure for increasing the match thereof, said capacitor pair structure comprising:

a first finger electrode structure having a first electrode and a plurality of first extended electrodes, wherein each said plurality of first extended electrodes has a first end and a second end, said plurality of first extended electrodes parallel to each other and said plurality of first ends connect to said first electrode;

a second finger electrode structure having a second electrode and a plurality of second extended electrodes, wherein each said plurality of second extended electrodes has a third end and a fourth end, said plurality of second extended electrodes parallel to each other and said plurality of third ends connect to said second electrode, said plurality of fourth ends are horizontally in opposition to said plurality of second ends; and

a third electrode structure having a plurality of third electrodes respectively interlacing between said first finger electrode structure and between said second finger electrode structure.

15. The capacitor pair structure according to claim 14, further comprising a fourth electrode, wherein said fourth electrode connects to said plurality of third electrodes by a plurality of third vias.

16. The capacitor pair structure according to claim 14, wherein said plurality of first extended electrodes are equidistant to each other, said plurality of second extended electrodes are equidistant to each other, said plurality of third electrodes are equidistant to each other.

17. The capacitor pair structure according to claim 14, wherein said plurality of first extended electrodes vertically connect to said first electrode, said plurality of second extended electrodes vertically connect to said second electrode.

18. The capacitor pair structure according to claim 14, wherein said plurality of third electrodes respectively equidistantly interlaces between said first finger electrode structure and said second finger electrode structure.

19. The capacitor pair structure according to claim 14, further comprising a guard dummy structure, wherein said guard dummy structure surrounds said first finger electrode structure, said second finger electrode structure, and said third electrode structure.

20. The capacitor pair structure according to claim 14, wherein said first finger electrode structure could connect to another first finger electrode structure on another conductive layer by a plurality of first vias, said second finger electrode structure could connect to another second finger electrode structure on another conductive layer by a plurality of second vias, said third electrode structure could connect to another third electrode structure on another conductive layer by a plurality of third vias.