Image sensor and method for fabricating the same

• US 20050139945A1
• Filed: 12/29/2004
• Published: 06/30/2005
• Est. Priority Date: 12/31/2003
• Status: Abandoned Application

• Current Assignee: DONGBU ELECTRONICS CO., LTD. (DB HiTek Co., Ltd.)
• Original Assignee: Dongbuanam Semiconductor, Inc. (DB HiTek Co., Ltd.)
• Inventors: Lim, Keun Hyuk
• Application Number:
  US11/026,903
• Publication Number:
  US 20050139945A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

Image sensor and method for fabricating the same are disclosed, wherein, instead of a traditional microlens array over a color filter array, a microlens pattern is arranged under the color filter array, which can permit shortening a total travel distance of a converged light to the photodiode, improve intensity and focus of the light finally reaching the photodiode array, and improve a low luminance performance of the image sensor. The minimized travel distance of the converged light, which optimizes intensity and focus of the light reaching the photodiode array, permits significantly improving an image quality reproduced by the image sensor.

Claims

1. An image sensor comprising:

a color filter array for converting an external light into a color light;

a microlens pattern under the color filter array for converging the color light passing through the color filter array;

a photodiode array in an active region of a semiconductor substrate for receiving the light converged at the microlens pattern, adapted to produce and store photo charges;

a light transmission layer over the photodiode array for supporting the microlens pattern and the color filter array, and transmitting the light converged at the microlens patterns toward the photodiode array.

2. The image sensor as claimed in claim 1, wherein each microlens includes:

a first lens pattern for passing a light from the color filter array toward the photodiode array in a substantially straight line, and

a rounded lens portion on sidewalls of the first lens portion, configured to refract the color light passing through the color filter array toward the photodiode array.

3. The image sensor as claimed in claim 2, wherein the rounded lens portion has a refractive index relatively greater than the first lens pattern.

4. The image sensor as claimed in claim 2, wherein the first lens pattern comprises an oxide, and the rounded lens portion comprises a nitride.

5. The image sensor as claimed in claim 2, wherein the first lens pattern has a thickness of 11,000 Å

˜

14,000 Å

, and the rounded lens portion has a thickness of 6000 Å

˜

8,000 Å

.

6. A method for fabricating an image sensor comprising the steps of:

forming a photodiode array in an active region of a semiconductor substrate defined by an active cell isolation film;

forming a light transmission layer on the photodiode array;

forming a microlens pattern on the light transmission layer, the microlens pattern being adapted to converge an external light; and

forming a color filter array over the microlens pattern.

7. The method as claimed in claim 6, wherein the step of forming the microlens pattern includes the steps of:

depositing and patterning an oxide film on the light transmission layer to form a first lens pattern; and

depositing a nitride film on the light transmission layer to cover the first lens pattern, and etching the nitride film to form rounded shapes on sidewalls of the first lens pattern.