Methods of making microelectronic assemblies including compliant interfaces
First Claim
Patent Images
1. An assembly comprising:
- (a) a structure;
(b) a plurality of terminals; and
(c) a plurality of compliant pads disposed between said terminals and said structure, said terminals being aligned with at least some of said pads, said pads providing a standoff between said structure and said terminals.
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Abstract
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
90 Citations
20 Claims
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1. An assembly comprising:
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(a) a structure;
(b) a plurality of terminals; and
(c) a plurality of compliant pads disposed between said terminals and said structure, said terminals being aligned with at least some of said pads, said pads providing a standoff between said structure and said terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification