Method and device for alignment of a substrate

• US 20050140960A1
• Filed: 10/08/2004
• Published: 06/30/2005
• Est. Priority Date: 10/10/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Andreas Hazenberg, Johannes Martinus, Visser, Raimond, Jacobus Tinnemans, Patricius Aloysius
• Granted Patent: US 7,307,695 B2
• Time in Patent Office: Days
• US Class Current: 355/72
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• CPC Class Codes: G03F 9/7096 Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus

Abstract

Embodiments of the invention include a method of placing a substrate on a support. In an embodiment of the invention, the method includes determining a position of the substrate relative to a reference position via a sensor which outputs a sensor signal to a control unit, the determining including detecting the position of the substrate in a chamber, and determining a gripping position on the substrate; gripping the substrate at the gripping position with a gripper controlled by the control unit, and providing the substrate in a defined position on the support member, the providing including moving the substrate to a fixed position relative to the support member such that the center of the substrate arrives at a predetermined position on the support member.

Claims

1. A method of placing a substrate on a support member, the method comprising:

(a) determining a position of the substrate relative to a reference position via a sensor which outputs a sensor signal to a control unit, said determining including

(i) detecting the position of the substrate in a chamber, and

(ii) determining a gripping position on the substrate;

(b) gripping the substrate at said gripping position with a gripper controlled by the control unit, and

(c) providing the substrate in a defined position on the support member, said providing including moving the substrate to a fixed position relative to the support member such that the centre of the substrate arrives at a predetermined position on the support member.

3. The method of claim 1, wherein the chamber is a reduced pressure transfer device, the method further comprising placing the substrate in the transfer device and evacuating the transfer device.

4. The method of claim 1, wherein the support member comprises a rotatable support surface having an axis of rotation substantially perpendicular to the support surface, the substrate being placed with its centre at or near the rotation axis.

5. The method of claim 4, further comprising:

rotating the support surface of the support member with the substrate thereon and detecting a number of edge positions of the substrate with a sensor,

capturing the substrate from the support member using the gripper and

returning the substrate with its centre and its angular orientation in a defined position on the support member.

6. The method of claim 3, wherein the sensor is arranged in the transfer device.

7. The method of claim 1, wherein the sensor is arranged between the transfer device and the support member, the method further comprising moving the substrate relative to the sensor, calculating on the basis of a sensor signal from the sensor a position of the substrate, and directing the gripper to the fixed position.

9. The method according to claim 4, wherein the sensor is arranged at or near the support member, the method further comprising calculating on the basis of a sensor signal from the sensor a position of the substrate and directing the gripper such that the centre of the substrate is located at or near the rotation axis.

10. The method of claim 1, further comprising calculating on the basis of signals from the sensor substrate edge positions R(φ

) at different angles φ

with respect to the support member in support member coordinates and determining a frequency component of the calculated edge position, the absolute value and phase of which representing an offset of a substrate coordinate center from a support member coordinate center.

11. The method of claim 10, wherein three detectors are distributed around the substrate at angular intervals of substantially 90°

, 60° and

45°

from a first detector.

12. The method of claim 1, wherein the sensor is a video camera, a signal of which being used in the control unit as a feedback signal for motion control of the gripper.

14. The method according to claim 11, wherein the projection beam includes EUV radiation.

2. A method of placing a substrate on a support member, the method comprising:

determining a position of the substrate located in a chamber relative to a reference position of the support member via a sensor which outputs a sensor signal to a control unit,

gripping the substrate using a gripper at a fixed gripping position relative to the chamber;

detecting the position of the gripped substrate using the sensor, and

moving the substrate to a varying position relative to the support member such that the centre of the substrate arrives at a predetermined position on the support member.

8. The method of claim 2, wherein the sensor is arranged between the transfer device and the support member, the method further comprising moving the substrate relative to the sensor, calculating on the basis of a sensor signal from the sensor a position of the substrate, and directing the gripper to the varying position.

13. A device manufacturing method comprising:

(1) projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material disposed on a substrate, and

(2) positioning the substrate on a support member, said positioning including

(a) determining a position of the substrate relative to a reference position via a sensor which outputs a sensor signal to a control unit, said determining including

(i) detecting the position of the substrate in a chamber, and

(ii) determining a gripping position on the substrate;

(b) gripping the substrate at said gripping position with a gripper controlled by the control unit, and

(c) providing the substrate in a defined position on the support member, said providing including moving the substrate to a fixed position relative to the support member such that the centre of the substrate arrives at a predetermined position on the support member.

15. A substrate handler comprising:

a chamber including a substrate support member configured to receive a substrate thereon;

a transfer device configured to transfer the substrate from a first atmosphere into the chamber;

a sensor configured to determine the position of the substrate relative to a reference position;

a control unit connected to the sensor;

a gripper arranged in the chamber and configured to capture the substrate in the transfer device and to transfer the substrate to the support member, the gripper being controlled by the control unit;

wherein the sensor is adapted to detect the position of the substrate relative to the chamber, and

wherein the control unit is configured to determine a gripping position on the substrate and to control the gripper to (1) capture the substrate at the gripping position and (2) move the substrate to a fixed position relative to the support member such that the centre of the substrate is positioned at a predetermined position on the support member.

17. The substrate handler of claim 15, wherein the chamber comprises a chamber of reduced pressure and the transfer device comprises a load lock device configured to sustain a reduced pressure therein.

18. The substrate handler of claim 15, wherein the support member comprises a rotatable support surface having an axis of rotation substantially perpendicular to the surface, the substrate being placeable with its centre at or near the rotation axis by the gripper.

19. The substrate handler of claim 15, wherein the sensor is provided in the transfer device.

20. The substrate handler of claim 15, wherein the sensor is provided between the transfer device and the support member.

21. The substrate handler of claim 18, wherein the sensor is provided at or near the support member and the control unit is adapted to calculate on the basis of a sensor signal from the sensor a position of the substrate to direct the gripper such that the centre of the substrate is located at or near the rotation axis.

22. The substrate handler of claim 15, comprising at least three detectors distributed around the substrate at angular intervals of substantially 90°

, 60° and

45°

from a first detector.

16. A substrate handler comprising:

a chamber including a substrate support member configured to receive a substrate thereon;

a transfer device configured to transfer the substrate from a first atmosphere into the chamber;

a sensor configured to determine the position of the substrate relative to a reference position;

a control unit connected to the sensor, and

a gripper arranged in the chamber and configured to capture the substrate in the transfer device and to transfer the substrate to the support member, the gripper being controlled by the control unit,

wherein the control unit is adapted to control the gripper to (1) grip the substrate at a fixed gripping position relative to the chamber and (2) move the substrate to a varying position relative to the support member such that the center of the substrate arrives at a predetermined position on the support member, and

wherein the sensor is adapted to detect the position of the gripped substrate.

23. A lithographic projection apparatus comprising:

(a) a radiation system configured to condition a beam of radiation;

(b) a support structure configured to support a patterning device, the patterning device serving to pattern the beam of radiation according to a desired pattern;

(c) a projection system configured to project the patterned beam of radiation onto a target of the substrate, and

(d) a substrate handler comprising;

(i) a chamber including a substrate support member configured to receive the substrate thereon;

(ii) a transfer device configured to transfer the substrate from a first atmosphere into the chamber;

(iii) a sensor configured to determine the position of the substrate relative to a reference position;

(iv) a control unit connected to the sensor; and

(v) a gripper arranged in the chamber and configured to capture the substrate in the transfer device and to transfer the substrate to the support member, the gripper being controlled by the control unit;

wherein the sensor is adapted to detect the position of the substrate relative to the chamber, and

wherein the control unit is configured to determine a gripping position on the substrate and to control the gripper to (1) capture the substrate at the gripping position and (2) move the substrate to a fixed position relative to the support member such that the center of the substrate is positioned at a predetermined position on the support member.