Light emitting device and fabrication method thereof

• US 20050141240A1
• Filed: 09/30/2004
• Published: 06/30/2005
• Est. Priority Date: 09/30/2003
• Status: Abandoned Application

• Current Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Kunisato, Tatsuya, Hirano, Hitoshi, Hiroyama, Ryoji, Kuramoto, Keiichi, Hata, Masayuki
• Application Number:
  US10/953,066
• Publication Number:
  US 20050141240A1
• Time in Patent Office: Days
• US Class Current: 362/600
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A pre-curing viscous solution (precursor solution) is applied to the back surface of a substrate for forming an optically transparent layer principally composed of an inorganic material. The substrate is heated or irradiated with UV light while being pressed with unevenness of a mold. By removing the substrate from the mold, the optically transparent, inorganic material layer principally composed of the inorganic material is formed on the substrate. In this manner, the inorganic material layer with the unevenness is formed on the back surface of the substrate (a light extraction surface) by embossing.

Claims

1. A light emitting device comprising:

a light emitting device structure including a light emitting layer and having a light extraction surface; and

a layer principally composed of an inorganic material different from a material constituting said light extraction surface, and formed on said light extraction surface of said light emitting device structure, wherein

said layer principally composed of the inorganic material is optically transparent to a luminescent wavelength of said light emitting device structure, and has unevenness on a surface opposite to said light extraction surface, and

said layer principally composed of the inorganic material includes a plurality of layers having different refractive indices, the refractive index of a layer on the side of said light extraction surface being greater than the refractive indice of another layer.

2. The light emitting device according to claim 1, wherein

said layer principally composed of the inorganic material has a refractive index greater than the refractive index of the material constituting said light extraction surface.

3. The light emitting device according to claim 1, wherein

said inorganic material includes a metal oxide.

4. The light emitting device according to claim 1, wherein

said layer principally composed of the inorganic material includes fine particles.

5. The light emitting device according to claim 4, wherein

said fine particles are composed of a metal oxide.

6. The light emitting device according to claim 1, wherein

said layer principally composed of the inorganic material includes an organometallic polymer having an -M-O-M-bond, where M is a metal and O is an oxygen atom.

7. The light emitting device according to claim 6, wherein

said organometallic polymer is synthesized from at least one kind of organometallic compounds having a hydrolytic organic group.

8. The light emitting device according to claim 7, wherein

said organometallic compound is a metal alkoxide.

9. The light emitting device according to claim 7, wherein

said organometallic compound has functional groups directly or indirectly bonding to a metal atom, at least one of which can be cured by being subjected to externally supplied energy to be bridged.

10. The light emitting device according to claim 9, wherein

said externally supplied energy is one of or both of energy by heating and energy by irradiation of light.

11. The light emitting device according to claim 7, wherein

said organometallic compound includes at least one or more compounds selected from the group consisting of 3-methacryloxypropyltriethoxysilane (MPTES), 3-methacryloxypropyltrimethoxysilane (MPTMS), and 3-acryloxypropyltrimethoxysilane.

12. The light emitting device according to claim 1, wherein

said layer principally composed of the inorganic material has a structure in which the inorganic material is dispersed in an organic polymer.

13. A light emitting device comprising:

a light emitting device structure including a light emitting layer and having a light extraction surface; and

a layer principally composed of an inorganic material different from a material constituting said light extraction surface, and formed on said light extraction surface of said light emitting device structure, wherein

said layer principally composed of the inorganic material is optically transparent to a luminescent wavelength of said light emitting device structure, and has unevenness on a surface opposite to said light extraction surface,

said light emitting device structure constitutes a light emitting device chip, and

said layer principally composed of the inorganic material is formed on said light extraction surface of said light emitting device chip except its outer peripheral region or is smaller in thickness on the outer peripheral region of said light extraction surface of said light emitting device chip than on its remaining region.

14. The light emitting device according to claim 13, wherein

said layer principally composed of the inorganic material has a refractive index greater than the refractive index of the material constituting said light extraction surface.

15. The light emitting device according to claim 13, wherein

said inorganic material includes a metal oxide.

16. The light emitting device according to claim 13, wherein

said layer principally composed of the inorganic material includes fine particles.

17. The light emitting device according to claim 16, wherein

said fine particles are composed of a metal oxide.

18. The light emitting device according to claim 13, wherein

said layer principally composed of the inorganic material includes an organometallic polymer having an -M-O-M-bond, where M is a metal and O is an oxygen atom.

19. The light emitting device according to claim 18, wherein

said organometallic polymer is synthesized from at least one kind of organometallic compounds having a hydrolytic organic group.

20. The light emitting device according to claim 19, wherein

said organometallic compound is a metal alkoxide.

21. The light emitting device according to claim 19, wherein

said organometallic compound has functional groups directly or indirectly bonding to a metal atom, at least one of which can be cured by being subjected to externally supplied energy to be bridged.

22. The light emitting device according to claim 21, wherein

said externally supplied energy is one of or both of energy by heating and energy by irradiation of light.

23. The light emitting device according to claim 19, wherein

said organometallic compound includes at least one or more compounds selected from the group consisting of 3-methacryloxypropyltriethoxysilane (MPTES), 3-methacryloxypropyltrimethoxysilane (MPTMS), and 3-acryloxypropyltrimethoxysilane.

24. A method of fabricating a light emitting device comprising the steps of:

forming a light emitting device structure including a light emitting layer and having a light extraction surface; and

forming on said light extraction surface of said light emitting device structure a layer principally composed of an inorganic material different from a material constituting said light extraction surface that is optically transparent to a luminescent wavelength of said light emitting device structure and having unevenness on the surface opposite to said light extraction surface, wherein

said step of forming said layer principally composed of the inorganic material includes the step of forming said unevenness by embossing.

25. The method of fabricating a light emitting device according to claim 24, wherein

said step of forming said layer principally composed of the inorganic material includes the step of forming said layer principally composed of the inorganic material layer by applying a solution on said light extraction surface of said light emitting device structure.

26. The method of fabricating a light emitting device according to claim 25, wherein

said solution is a solution in which fine particles are dispersed.

27. The method of fabricating a light emitting device according to claim 25, wherein

said solution includes an organic polymer in which fine particles are dispersed.

28. The method of fabricating a light emitting device according to claim 27, wherein

said fine particles are composed of a metal oxide.

29. The method of fabricating a light emitting device according to claim 27, wherein

said solution includes an organometallic polymer having an -M-O-M-bond, where M is a metal and O is an oxygen atom.

30. The method of fabricating a light emitting device according to claim 29, wherein

said organometallic polymer is synthesized from at least one kind of organometallic compounds having a hydrolytic organic group.

31. The method of fabricating a light emitting device according to claim 30, wherein

said organometallic compound is a metal alkoxide.

32. The method of fabricating a light emitting device according 2 to claim 30, wherein

said organometallic compound has functional groups directly or indirectly bonding to a metal atom, at least one of which can be cured by being subjected to externally supplied energy to be bridged.

33. The method of fabricating a light emitting device according to claim 32, wherein

said externally supplied energy is one of or both of energy by heating and energy by irradiation of light.

34. The method of fabricating a light emitting device according to claim 30, wherein

said organometallic compound includes at least one or more compounds selected from the group consisting of 3-methacryloxypropyltriethoxysilane (MPTES), 3-methacryloxypropyltrimethoxysilane (MPTMS), and 3-acryloxypropyltrimethoxysilane.