Micro-fluidic heating system

• US 20050142036A1
• Filed: 07/27/2004
• Published: 06/30/2005
• Est. Priority Date: 12/26/2003
• Status: Active Grant

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Lim, Yong Taik, Kim, Sung Jin, Lee, Dae Sik, Park, Se Ho, Yang, Hae Sik, Kim, Yun Tae, Kim, Kyu Won, Chung, Kwang Hyo
• Granted Patent: US 7,682,571 B2
• Time in Patent Office: Days
• US Class Current: 422/99
• CPC Class Codes: B01J 2219/00286 Reactor vessels with top and bottom openings
• CPC Class Codes: B01J 2219/00389 Feeding through valves
• CPC Class Codes: B01J 2219/00495 Means for heating or cooling the reaction vessels
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/00833 Plastic
• CPC Class Codes: B01J 2219/00869 Microreactors placed in parallel, on the same or on different supports
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 7/00 Heating or cooling apparatus autoclaves B01J3/04; Heat insulating devices
• CPC Class Codes: C40B 60/14 for creating libraries
• CPC Class Codes: H05B 2203/003 using serpentine layout
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 2203/017 Manufacturing methods or apparatus for heaters
• CPC Class Codes: H05B 3/26 heating conductor mounted on insulating base for transparent areas H05B3/84, H05B3/86

Abstract

Provided is a micro-fluidic heating system, which comprises a micro-fluidic control element for providing a chamber, a flow path and a valve, and a main body for heating the inside of the chamber in contact with the micro-fluidic control element, wherein the micro-fluidic control element consists of an upper substrate for providing the chamber, the flow path and the valve, and a lower substrate as a thin film bonded to the upper substrate, and the main body consists of a membrane in which heating means and suction holes are formed, and support member for supporting the membrane, and the heating means is partially in contact with the lower substrate of the chamber to heat the inside of the chamber, so that thermal transfer efficiency becomes maximized and temperature of each chamber may be independently controlled in the case of configuration having chambers arranged in array.

Claims

1. A micro-fluidic heating system, comprising:

a micro-fluidic control element including an upper substrate for providing a chamber and a flow path for transporting micro fluid to the chamber, and a lower substrate bonded to the upper substrate so as to shield the chamber and the flow path; and

a main body including a membrane, heating means formed on the membrane, and a support member for supporting the membrane,

wherein the micro-fluidic control element and the main body are joined to each other so as to have the heating means of the main body contacted with the lower substrate of the chamber.

2. The micro-fluidic heating system as claimed in claim 1, further comprising:

a valve for controlling flow of micro fluid formed in the flow path of the upper substrate.

3. The micro-fluidic heating system as claimed in claim 1, wherein the heating means is a micro heater.

4. The micro-fluidic heating system as claimed in claim 1, further comprising:

a temperature sensor formed on the membrane; and

electrode pads formed on the membrane and connected to the heating means and the temperature sensor.

5. The micro-fluidic heating system as claimed in claim 1, further comprising:

a cooling plate attached below the structure.

6. The micro-fluidic heating system as claimed in claim 1, wherein a plurality of suction holes are formed in the membrane.

7. The micro-fluidic heating system as claimed in claim 1, wherein the upper and lower substrates are formed of any one of a glass, a high molecule, and a metal.

8. The micro-fluidic heating system as claimed in claim 6, wherein the high molecule includes any one of PDMS, PMMA, PC, COC, PA, PE, PP, PPE, PS, POM, PEEK, PTFE, PVC, PVDF, PBT, FEP, PFA, and PET.

9. The micro-fluidic heating system as claimed in claim 1, wherein the lower substrate is formed to have a thickness of 1 μ

m to 100 μ

m.

10. The micro-fluidic heating system as claimed in claim 1, wherein the membrane is formed of any one of a silicon nitride layer, a silicon oxide layer, and a synthetic high molecular material, and has a thickness of 0.1 μ

m to 20 μ

m.

11. The micro-fluidic heating system as claimed in claim 1, wherein the structure is formed of any one of metal and silicon.

12. A micro-fluidic heating system, comprising:

a micro-fluidic control element including an upper substrate for providing a plurality of chambers and a plurality of flow paths for transporting micro fluid to each chamber arranged in array, and a lower substrate bonded to the upper substrate so as to shield the chambers and the flow paths; and

a main body including a membrane, a plurality of heating means formed on the membrane, and a support member for supporting the membrane,

wherein the micro-fluidic control element and the main body are joined to each other so as to have each of the heating means of the main body contacted with the lower substrate of each of the chambers.

13. The micro-fluidic heating system as claimed in claim 12, further comprising:

a valve for controlling flow of micro fluid formed in the flow path of the upper substrate.

14. The micro-fluidic heating system as claimed in claim 12, wherein the heating means is a micro heater.

15. The micro-fluidic heating system as claimed in claim 12, further comprising:

a temperature sensor formed on the membrane; and

electrode pads formed on the membrane and connected to the heating means and the temperature sensor.

16. The micro-fluidic heating system as claimed in claim 12, further comprising:

a cooling plate attached below the structure.

17. The micro-fluidic heating system as claimed in claim 12, wherein a plurality of suction holes are formed in the membrane.

18. The micro-fluidic heating system as claimed in claim 12, wherein the upper and lower substrates are formed of any one of a glass, a high molecule, and a metal.

19. The micro-fluidic heating system as claimed in claim 16, wherein the high molecule includes any one of PDMS, PMMA, PC, COC, PA, PE, PP, PPE, PS, POM, PEEK, PTFE, PVC, PVDF, PBT, FEP, PFA, and PET.

20. The micro-fluidic heating system as claimed in claim 12, wherein the lower substrate is formed to have a thickness of 1 μ

m to 100 μ

m.

21. The micro-fluidic heating system as claimed in claim 12, wherein the membrane is formed of any one of a silicon nitride layer, a silicon oxide layer, and a synthetic high molecular material, and has a thickness of 0.1 μ

m to 20 μ

m.

22. The micro-fluidic heating system as claimed in claim 12, wherein the structure is formed of any one of metal and silicon.