Method for fabricating a structure for a microelectromechanical system (MEMS) device

• US 20050142684A1
• Filed: 09/14/2004
• Published: 06/30/2005
• Est. Priority Date: 02/12/2002
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Miles, Mark W.
• Granted Patent: US 7,250,315 B2
• Time in Patent Office: Days
• US Class Current: 438/48
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81C 1/00396 Mask characterised by its composition, e.g. multilayer masks
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

The invention provides a microfabrication process which may be used to manufacture a MEMS device. In one embodiment, the process comprises depositing at least one first layer on a substrate. The process further comprises patterning said first layer to define at least a first portion of said microelectromechanical system device. The process further comprises depositing a second layer on said first layer. The process further comprises patterning said second layer using said first layer as a photomask. The process further comprises developing said second layer to define at least a second portion of the microelectromechanical system device.

Claims

1. A method of fabricating a microelectromechanical system device, comprising:

depositing at least one first layer on a substrate;

patterning said first layer to define at least a first portion of said microelectromechanical system device;

depositing a second layer on said first layer;

patterning said second layer using said first layer as a photomask; and

developing said second layer to define at least a second portion of the microelectromechanical system device.