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Controls of ambient environment during wafer drying using proximity head

  • US 20050145267A1
  • Filed: 04/01/2004
  • Published: 07/07/2005
  • Est. Priority Date: 09/30/2002
  • Status: Active Grant
First Claim
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1. A method for processing a substrate, comprising:

  • generating a fluid meniscus to process the substrate;

    applying the fluid meniscus to a surface of the substrate; and

    managing a substrate processing environment so evaporation of fluids from a surface in the substrate processing environment is reduced.

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