Shower head of a wafer treatment apparatus having a gap controller
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Accused Products
Abstract
A shower head for adjusting distribution of a reactant gas in a process region of a semiconductor manufacturing reaction chamber, wherein a top plate has a gas port for introducing the reactant gas into the reaction chamber; a face plate, having through holes, disposed opposite the process region; a first baffle plate, having through holes, disposed between the top plate and the face plate and capable of moving up or down, wherein the first baffle plate has a top surface that defines a first gap for forming a first lateral flow passage; a second baffle plate, having through holes, disposed between the first baffle plate and the face plate and capable of moving up or down, wherein the second baffle plate has a top surface that defines a second gap for forming a second lateral flow passage; and a gap controller for determining widths of the first and second gaps.
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Citations
108 Claims
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1-55. -55. (canceled)
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70-92. -92. (canceled)
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93. A shower head comprising:
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a first baffle plate having a plurality of through holes;
a second baffle plate disposed below the first baffle plate with a gap having a predetermined width interposed between the first and second baffle plates, the second baffle plate having a plurality of through holes; and
a plurality of piezoelectric elements disposed between the first and second baffle plates for controlling the amount of a reactant gas flowing through the plurality of through holes formed in the first baffle plate. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108)
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Specification