Fabrication of MEMS devices with spin-on glass
First Claim
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1. A microstructure for use in the manufacture of a MEMS device, comprising:
- a bulk layer having a rough surface;
at least one layer of photo-insensitive spin-on planarizing material deposited on said bulk layer;
a photoresist layer deposited on said planarizing material; and
a deep etch trench extending through said photoresist layer into said bulk layer.
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Abstract
A method of making an etched structure in the fabrication of a MEMS device involves depositing a bulk layer, typically of polysilicon, prone to surface roughness. At least one layer of photo-insensitive spin-on planarizing material, such as silicate-based spin-on glass, is formed on the bulk layer to reduce surface roughness. This is patterned with a photoresist layer. A deep etch is then performed through the photoresist layer into the bulk layer. This technique results in much more precise etch structures.
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Citations
10 Claims
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1. A microstructure for use in the manufacture of a MEMS device, comprising:
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a bulk layer having a rough surface;
at least one layer of photo-insensitive spin-on planarizing material deposited on said bulk layer;
a photoresist layer deposited on said planarizing material; and
a deep etch trench extending through said photoresist layer into said bulk layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification