Optical semiconductor device and method of manufacturing optical semiconductor device

• US 20050145991A1
• Filed: 01/04/2005
• Published: 07/07/2005
• Est. Priority Date: 01/05/2004
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tamura, Hideo, Sakamoto, Shin, Ogawa, Isao
• Granted Patent: US 7,210,807 B2
• Time in Patent Office: Days
• US Class Current: 257/604
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.

Claims

1. A device to emit a light beam, comprising:

a light emitting element;

an outer envelope defining an indentation in which the light emitting element is positioned, wherein the indentation comprises

a first indentation part corresponding to a lower part of the indentation, and

a second indentation part corresponding to an upper part of the indentation;

a projection strip between the first and second indentation parts, the projection strip projecting from an inner surface of the outer envelope; and

a conductive lead coupled to the light emitting element to supply electrical power.

2. The device according to claim 1,

wherein the light emitting element is placed in the first indentation part.

3. The device according to claim 2,

further comprising an optical resin filling the first indentation part.

4. The device according to claim 3,

wherein the projection strip prevents the optical resin from creeping up a surface of the second indentation part.

5. The device according to claim 3,

wherein the optical resin includes a thermosetting resin containing a phosphor.

6. The device according to claim 5,

wherein the light emitting element is for emitting ultraviolet light.

7. The device according to claim 3,

wherein the light emitting element is for emitting visible light.

8. The device according to claim 3,

wherein a surface of the optical resin is convex.

9. The device according to claim 3,

wherein the projection strip projects in a direction of a normal line of a primary plane of the conductive lead.

10. The device according to claim 3,

wherein the conductive lead comprises a first conductive lead on which the light emitting element is positioned and a second conductive lead which is connected to the light emitting element by a wire.

11. The device according to claim 3,

wherein the first indentation part is defined by a first wall, the second indentation part is defined by a second wall and the projection strip provided between the first and second walls projects from the surface of the second wall.

12. The device according to claim 11,

wherein the projection strip prevents the optical resin from creeping up the second wall.

13. The device according to claim 11,

wherein the second indentation part is tapered toward the first indentation part.

14. A method of manufacturing an optical semiconductor device, comprising:

setting a conductive lead in a die;

filling the die with a resin to form an outer envelope and a projection strip, the outer envelope forming an indentation comprising a first indentation part corresponding to a lower part of the indentation and a second indentation part corresponding to an upper part of the indentation, wherein the projection strip provided between the first and second indentation parts projects from an inner surface of the indentation;

positioning a light emitting element in the first indentation part; and

filling an optical resin into the first indentation part.

15. A method of manufacturing an optical semiconductor device according to claim 14, wherein the die comprises a first die part and a second die part;

wherein filling the die includes filling the first die part to form an outer surface of the outer envelope, and filling the second die part to form the indentation with the resin.

16. A method of manufacturing an optical semiconductor device according to claim 15, wherein the second die part comprises a core pin die part and a sleeve die part;

wherein filling the second die part comprises filling the core pin die part to form an inner surface of the projection strip, and filling the sleeve die part to form an outer surface of the projection strip with the resin.

17. A method of manufacturing an optical semiconductor device according to claim 14,

wherein positioning a light emitting element includes placing a light emitting element for emitting ultraviolet light.

18. A method of manufacturing an optical semiconductor device according to claim 14,

further comprising placing a surface of the filled optical resin downward so that the resin forms with a convex surface.