Method of applying a cover layer to a structured base layer

• US 20050147740A1
• Filed: 12/08/2004
• Published: 07/07/2005
• Est. Priority Date: 12/08/2003
• Status: Abandoned Application

• Current Assignee: LPKF Laser & Electronics AG
• Original Assignee: LPKF Laser & Electronics AG
• Inventors: Agater, Michael
• Application Number:
  US11/006,622
• Publication Number:
  US 20050147740A1
• Time in Patent Office: Days
• US Class Current: 427/96.100
• CPC Class Codes: B23K 26/04 Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• CPC Class Codes: B32B 2305/34 Inserts
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 37/20 involving the assembly of continuous webs only
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/1841 during laying up
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/0032 of organic insulating material
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence

Abstract

A method for applying a cover layer (1) to a base layer (2) which is provided with structuring (3) determined, for example, by printed conductors. The base layer (2) is moved continuously at a feed rate (v) in continuous operation. A guide (4) constructed as a rotatable body, brings the cover layer (1) to the matching feed rate (v) and applies the cover to the base layer (2). To optimize the application of the cover layer (1) to the structure (3) on the base layer (2), and in particular to prevent inaccuracies in the correlation between the cover layer (1) and the base layer (2) while at the same time permitting increased flexibility in manufacturing, the position of the structuring (3) is determined first by a non-contact sensor (5) immediately upstream of the guide (4). Then a signal for a laser (6) is triggered by a control unit (9). Depending on the position of the structuring (3), a recess is then created in the cover layer (1) by the laser (6), and the recess is thereafter made to correspond to the structuring (3).

Claims

1. A method of applying a cover layer to a base layer which has a structured surface, said method comprising moving said base layer at a first feed rate (v);

moving the cover layer at a second feed rate which matches said first feed rate; and

applying the cover layer to the base layer via a guide;

wherein in order to achieve a desired synchronization said method further comprises prior to the application of the cover layer to the base layer the steps of;

determining the position of a structure on the structured surface of the base layer via a sensor;

utilizing positional information from the position determination of the structure to trigger a laser control signal, and controlling a laser in response to said control signal to create a recess in said cover layer in a position corresponding to the position of said structure on said base layer, whereby said structure is received in said recess when said cover layer is applied to said base layer.

2. A method according to claim 1, further comprising detecting the forward movement of the base layer with a displacement sensor.

3. A method according to claim 1, wherein the shape of the structure is also determined, and the recess in the cover layer is created with a corresponding shape.

4. A method according to claim 1, wherein the structure on the base layer comprises a plurality of discrete printed conductors.

5. A method according to claim 1, wherein the cover layer is applied to the base layer in a continuous operation.

6. A method according to claim 1, wherein the position of the structure on the base layer is determined by a non-contact method.

7. A method according to claim 6, wherein the position of the structure on the base layer is determined with a CCD sensor.

8. A method according to claim 1, further comprising adjusting the laser output in accordance with the feed rate of the cover layer.

9. A method according to claim 1, wherein the recess is ablated according to the projection principle.

10. A method according to claim 1, wherein the recess is ablated through a mask positioned between the laser and the cover layer.

11. A method-according to claim 1, wherein openings are created in the cover layer by the laser.

12. A method according to claim 1, wherein the recess comprises a cavity created in the cover layer by the laser, whereby a hollow space is created between the base layer and the cover layer.

13. A method according to claim 1, wherein material released from the cover layer by the laser in creating the recess is removed by suction.

14. A method according to claim 1, wherein the cover layer is applied to the base layer with a predetermined contact pressure by a rotating body.

15. A method according to claim 1, wherein the base layer comprises a film.

16. A method according to claim 1, wherein the cover layer is a film.

17. A method according to claim 1, wherein the base layer and the cover layer are welded or glued together.

18. A method according to claim 1, wherein said laser is an excimer laser, a CO₂ laser or an Nd:

YAG laser.