Alignment and orientation features for a semiconductor package

• US 20050148116A1
• Filed: 02/16/2005
• Published: 07/07/2005
• Est. Priority Date: 01/21/2000
• Status: Active Grant

• Current Assignee: Leonard E. Mess, Stuart L. Roberts, William J. Reeder
• Original Assignee: Leonard E. Mess, Stuart L. Roberts, William J. Reeder
• Inventors: Roberts, Stuart L., Mess, Leonard E., Reeder, William J.
• Granted Patent: US 7,229,905 B2
• Time in Patent Office: Days
• US Class Current: 438/123
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor

Abstract

A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system

Claims

1. A method of determining locations of a plurality of bonding pads of a lead frame of a semiconductor device so as to allow formation of wire bonds to said plurality of bonding pads by a wire bonding system, the method comprising:

providing a first reference location of said wire bonding system, said first reference location providing a reference for wire bond locations;

obtaining an image of the said lead frame, said lead frame having at least one distinctive feature that has a known orientation relative to said plurality of bonding pads;

identifying said at least one distinctive feature from said image by pattern recognition; and

determining an orientation of said identified at least one distinctive feature relative to said first reference location, so as to allow determination of wire bond locations relative to said first reference location.

6. The method of claim 1, wherein said at least one distinctive feature comprises at least one eyepoint feature having an asymmetric shape with respect to said lead frame.

7. The method of claim 6, wherein said at least one eyepoint feature comprises a feature having an edge with a sharp corner at one end and a rounded corner at the other end.

8. The method of claim 6, wherein said at least one eyepoint feature comprises a feature having a triangular peak shape with said peak pointing in a selected direction.

2. The method of claim 2, further comprising:

identifying orientation of a semiconductor die that has been placed on said lead frame, said die having a plurality of die bonding pads disposed about said die in a known manner; and

determining locations of die bonding pads relative to said first reference location.

3. The method of claim 2, further comprising forming a plurality of wire bonds between said wire bond locations on said lead frame and said die bonding pads.

4. The method of claim 2, wherein obtaining the image comprises obtaining a digital image of said lead frame.

5. The method of claim 4, wherein obtaining the digital image comprises obtaining a digital image of said lead frame with said die placed on said lead frame.