Lithographic contact elements
1 Assignment
0 Petitions
Accused Products
Abstract
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
108 Citations
67 Claims
-
1-38. -38. (canceled)
-
39. A method for testing an electronic device, said method comprising:
-
providing a first substrate comprising a plurality of contact structures, each said contact structure comprising a post disposed on a terminal of said first substrate, a cantilevered beam attached to said post, and a tip attached to said beam, wherein said post, said beam, and said post are formed separately;
bringing ones of said contact structures into contact with terminals of said electronic device; and
testing said electronic device through said ones of said contact structures. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
-
-
58. An apparatus for making temporary electrical connections with terminals of an electronic device, said apparatus comprising:
-
a substrate comprising a plurality of first terminals disposed on a first surface of said substrate;
a plurality of posts, ones of said posts disposed on ones of said first terminals;
a plurality of cantilevered beams, ones of said beams attached to ones of said post, and a plurality of tips, ones of said tips attached to ones of said beams, wherein said posts, said beams, and said tips are separately formed, and said terminals of said electronic device are disposed in a first pattern and ones of said tips are also disposed in said first pattern. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67)
-
Specification