Apparatus and method for controlled cleaving

• US 20050150597A1
• Filed: 01/09/2004
• Published: 07/14/2005
• Est. Priority Date: 01/09/2004
• Status: Abandoned Application

• Current Assignee: Silicon Genesis
• Original Assignee: Silicon Genesis
• Inventors: Teoh, Hongbee, Paler, Anthony, Lamm, Albert, Henley, Francois, Ong, Philip
• Application Number:
  US10/754,980
• Publication Number:
  US 20050150597A1
• Time in Patent Office: Days
• US Class Current: 156/344
• CPC Class Codes: B28D 5/00 Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor working by grinding or polishing B24; for artistic purposes B44B
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: Y10T 156/1928 Differential fluid pressure delaminating means

Abstract

An apparatus and method for controlled cleaving is presented. Embodiments of the present invention include an apparatus for cleaving a substrate comprising a bottom shell coupled to a hinge mechanism, a top shell coupled to the hinge mechanism, a plurality of o-rings or suction cups coupled to the top and bottom shells for providing a suction force sufficient to exert a tensile force to the top and bottom of a substrate, a compliant member for sealing a portion of a grove edge of a substrate and for maintaining a pressure inside a volume formed between the groove edge and the groove edge of the substrate, a gas port for supplying gas to the volume, and a height adjustment mechanism coupled to the top shell and the bottom shell for separating the top shell from the bottom shell. One embodiment of the invention eliminates the use of gas system and is replaced by a blade edge to initiate propagation and applied tensile force of suction cups to apply tensile forces prior to initiation, control cleave process and maintain layer separation during and after cleaving.

Claims

1. ) A method for forming a thin film of material from a bonded substrate using a controlled cleaving process comprising:

applying a tensile force along both sides of a portion of an edge of said bonded substrate;

initiating a cleave within said bonded substrate by applying an additional force along said portion of said edge of said substrate assembly;

propagating said cleave by controlling said tensile force along said edge of said bonded substrate, wherein propagating said cleave frees a layer of said bonded substrate to be removed; and

separating said layer from said bonded substrate by applying said tensile force, wherein after said propagating, said layer of said bonded substrate to be removed does not touch said bonded substrate.

2. ) The method as described in claim 1 wherein said additional force is imparted by a static gas pressure developed between said edge of said bonded substrate and an o-ring along at least a portion of said bonded substrate circumference.

3. ) The method as described in claim 1 wherein an o-ring or suction cup provides a suction force to provide said tensile force used to separate said bonded substrate.

4. ) The method as described in claim 2 wherein a computer control module is used to control said static gas pressure.

5. ) The method as described in claim 2 wherein a burst of gas is used to provide said static gas pressure.

6. ) The method as described in claim 1 wherein said additional force is applied with a mechanical blade.

7. ) The method as described in claim 1 wherein an electrically controlled motor is used to separate said substrate assembly during cleaving.

8. ) A method of cleaving a bonded substrate comprising:

placing said bonded substrate on a first portion of a substrate cleaving shell;

placing said bonded substrate on a second portion of said substrate cleaving shell;

applying a tensile force along both sides of a portion of an edge of said bonded substrate;

initiating a cleave within said bonded substrate by applying an additional force along said portion of said edge of said bonded substrate;

propagating said cleave by controlling said tensile force along said edge of said bonded substrate, wherein propagating said cleave frees a portion of said bonded substrate to be removed; and

separating said portion of said bonded substrate to be removed from said substrate by maintaining said tensile force such that after said propagating, said portion of said bonded substrate to be removed does not touch said bonded substrate.

9. ) The method as described in claim 8 further comprising monitoring and controlling said initiating with a computer control module.

10. ) The method as described in claim 8 wherein said additional force is imparted by a static gas pressure developed between said edge of said bonded substrate and an o-ring along at least a portion of said bonded substrate circumference.

11. ) The method as described in claim 10 wherein said static gas pressure is pressurized nominally to about 300 to 3000 pounds per square inch.

12. ) The method as described in claim 8 wherein an electrically controlled motor is used to provide said tensile force by separating said cleaving shell.

13. ) An apparatus for controlled cleaving of a bonded substrate comprising:

a bottom shell coupled to a hinge mechanism;

a top shell coupled to said hinge mechanism;

a plurality of o-rings or suction cups coupled to said top and bottom shells for providing a suction force sufficient to exert a tensile force to a top and a bottom of said bonded substrate;

an initiating means for applying an additional force along a portion of an edge of said bonded substrate and for initiating a cleave in said bonded substrate; and

a height adjustment mechanism coupled to said top shell and said bottom shell for propagating said cleave by separating said top shell from said bottom shell.

14. ) The apparatus as described in claim 13 further comprising a computer control module for monitoring and adjusting said initiating means and said height adjustment mechanism.

15. ) The apparatus as described in claim 13 wherein said height adjustment mechanism provides said tensile force to said bonded substrate.

16. ) The apparatus as described in claim 15 wherein said tensile force prevents any portion of a cleaved layer from contacting said bonded substrate after cleaving of said portion is completed.

17. ) The apparatus as described in claim 13 wherein an electrically controlled motor is used to separate said top shell from said bottom shell.

18. ) The apparatus as described in claim 13 wherein said initiating means starts said propagating as a result of a substrate cleave action being detected.

19. ) The apparatus as described in claim 13 wherein a cleave position sensor and/or force sensor determines a position, a velocity and an acceleration of said cleave which is used to establish a separation profile.

20. ) The apparatus as described in claim 13 further comprising a sensor for monitoring a tensile force loss between said portion of said bonded substrate when an initiation cleave event has occurred to start said propagation of said cleave.

21. ) A method for controlling cleaving of a thin film of material from a bonded substrate comprising a planar surface comprising:

apply a tensile force on both side of said bonded substrate;

initiating a cleave in said bonded substrate by striking along a portion of an edge of said bonded substrate substantially parallel to said planar surface;

propagating said cleave by controlling acceleration and velocity of said cleave across said planar surface, wherein propagating said cleave frees a portion of said bonded substrate to be removed, and

separating said substrate into layers by maintaining said tensile force, wherein after said bonded substrate is cleaved, any portion of said cleaved layer does not touch said substrate.

22. ) The method as described in claim 21 wherein a plurality of O-rings or suction cups are used to apply said tensile force.

23. ) The method as described in claim 21 wherein a blade is used to initiate said cleave.

24. ) The method as described in claim 21 wherein a computer control module is used to control said acceleration and velocity of said cleave.

25. ) The method as described in claim 21 wherein an electrically controlled motor is used to control said acceleration and said velocity of said cleave.

26. ) The method as described in claim 25 wherein said electrically controlled motor is coupled to a hinge device for controlling said velocity and said acceleration of said cleave and for providing said tensile force for separating said layers.

27. ) An apparatus for controlling cleaving of layers from a bonded substrate comprising:

a bottom shell coupled to a hinge mechanism;

a top shell coupled to said hinge mechanism;

a plurality of compliant members coupled to said top and bottom shells for providing a suction force sufficient to exert a tensile force to a top and a bottom surface of a bonded substrate; and

an electrically controlled motor coupled to said hinge mechanism for controlling position, velocity and acceleration of a cleave front across said bonded substrate and for providing said tensile force wherein any portion of the separated layer does not touch said bonded substrate after said cleaving.

28. ) The apparatus as described in claim 27 further comprising a computer control module for monitoring and adjusting said electrically controlled motor.

29. ) The apparatus as described in claim 27 wherein said compliant member comprise an o-ring or suction cup.

30. ) The apparatus as described in claim 27 wherein said electrically controlled motor is a servo.

31. ) The apparatus as described in claim 27 wherein said electrically controlled motor is a stepper motor.

32. ) The apparatus as described in claim 27 wherein a cleave position sensor and/or force sensor determines said position, said velocity and said acceleration of said cleave which is used to establish a separation profile.