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High temperature environment tool system and method

  • US 20050150691A1
  • Filed: 11/18/2004
  • Published: 07/14/2005
  • Est. Priority Date: 11/18/2003
  • Status: Active Grant
First Claim
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1. A tool, comprising:

  • a tool body; and

    tool electronics located within the tool body, wherein the tool electronics comprise an integrated circuit formed on a substrate from a group consisting of silicon carbide substrates and sapphire substrates.

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