Light emission device

• US 20050151149A1
• Filed: 01/08/2004
• Published: 07/14/2005
• Est. Priority Date: 01/08/2004
• Status: Active Grant

• Current Assignee: Document Security Systems, Inc.
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Koay, Hui Peng, Chia, Chee Wai, Wong, Lye Yee
• Granted Patent: US 7,183,588 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emission device. A lead frame comprises a first lead frame segment and a second lead frame segment. A light source is coupled to the first lead frame segment. A wire bond is coupled to the light source and coupled to the second lead frame segment. A translucent epoxy cast encases the light source, the wire bond and a portion of the lead frame.

Claims

1. A light emission device comprising:

a lead frame comprising a first lead frame segment and a second lead frame segment;

a light source coupled to said first lead frame segment;

a wire bond coupled to said light source and coupled to said second lead frame segment; and

an epoxy cast encasing said light source, said wire bond, and a portion of said lead frame.

2. The light emission device as recited in claim 1 wherein said first lead frame segment comprises a first recess such that said light source resides at least partially within said first recess.

3. The light emission device as recited in claim 1 wherein said first lead frame segment comprises a second recess such that said epoxy cast is anchored to said first lead frame segment.

4. The light emission device as recited in claim 2 wherein said first recess is a reflector cup.

5. The light emission device as recited in claim 1 wherein said epoxy cast comprises a shaped epoxy portion.

6. The light emission device as recited in claim 1 wherein said lead frame comprises plating.

7. The light emission device as recited in claim 1 wherein said epoxy cast comprises a color tinting.

8. The light emission device as recited in claim 1 wherein said epoxy cast is operable to diffuse light from said light source.

9. The light emission device as recited in claim 1 further comprising a second wire bond coupled to said first lead frame segment and said light source.

10. The light emission device as recited in claim 5 wherein said shaped epoxy portion is a dome shape.

11. The light emission device as recited in claim 1 wherein said light source is a light emitting diode die.

12. A method for generating a light emission device, said method comprising:

coupling a light source to a first lead frame segment of a lead frame, said lead frame further comprising a second lead frame segment;

coupling a wire bond to said light source and said second lead frame segment; and

encasing said light source, said wire bond, and a portion of said lead frame in an epoxy cast.

13. The method as recited in claim 12 wherein said first lead frame segment comprises a first recess such that said light source resides at least partially within said first recess.

14. The method as recited in claim 13 wherein said first recess is a reflector cup.

15. The method as recited in claim 12 wherein said encasing comprises forming a shaped portion of said epoxy cast.

16. The method as recited in claim 12 further comprising dying said epoxy cast with a color tinting.

17. The method as recited in claim 12 further comprising diffusing at least a portion of said translucent epoxy cast.

18. The method as recited in claim 12 further comprising coupling a second wire bond to said first lead frame segment and said light source.

19. The method as recited in claim 12 wherein said light source is a light emitting diode die.

20. A light emission device comprising:

a lead frame comprising a first lead frame segment and a second lead frame segment;

a light emitting diode coupled to said first lead frame segment, said first lead frame segment comprising a first recess such that said light source resides at least partially within said first recess;

a wire bond coupled to said light source and coupled to said second lead frame segment; and

an epoxy cast encasing said light emitting diode, said wire bond, and a portion of said lead frame, said epoxy cast comprising a shaped epoxy portion.

21. The light emission device as recited in claim 20 wherein said first lead frame segment comprises a second recess such that said epoxy cast is anchored to said first lead frame segment.

22. The light emission device as recited in claim 20 wherein said first recess is a reflector cup.

23. The light emission device as recited in claim 20 wherein said shaped epoxy portion is incident to said light source.

24. The light emission device as recited in claim 20 wherein said lead frame comprises plating.

25. The light emission device as recited in claim 20 wherein said epoxy cast comprises a color tinting.

26. The light emission device as recited in claim 20 wherein said epoxy cast is operable to diffuse light from said light source.

27. The light emission device as recited in claim 20 further comprising a second wire bond coupled to said first lead frame segment and said light source.

28. The light emission device as recited in claim 20 wherein said shaped epoxy portion is a dome shape.