Semiconductor device having capacitors for reducing power source noise
First Claim
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1. A semiconductor device comprising:
- a BGA substrate having one principal plane furnished with a large number of solder balls, said solder balls constituting a ball grid array;
a semiconductor chip mounted on another principal plane of said BGA substrate, said semiconductor chip being electrically connected to said BGA substrate by metal wires; and
chip capacitors mounted on said semiconductor chip to reduce power source noise.
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Abstract
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.
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Citations
15 Claims
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1. A semiconductor device comprising:
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a BGA substrate having one principal plane furnished with a large number of solder balls, said solder balls constituting a ball grid array;
a semiconductor chip mounted on another principal plane of said BGA substrate, said semiconductor chip being electrically connected to said BGA substrate by metal wires; and
chip capacitors mounted on said semiconductor chip to reduce power source noise. - View Dependent Claims (5, 8)
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2-4. -4. (canceled)
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6-7. -7. (canceled)
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9. (canceled)
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10. A semiconductor device comprising:
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a semiconductor chip including bumps and active regions, said bumps serving as electrodes and being formed on one principal plane of said semiconductor chip, said active region being formed on the opposite side as said bumps;
wherein chip capacitors can be attached to said active regions of said semiconductor chip, and said chip capacitors are served to reduce power source noise. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification