Adhesive film for circuit connection, and circuit connection structure

• US 20050151271A1
• Filed: 01/06/2005
• Published: 07/14/2005
• Est. Priority Date: 01/07/2004
• Status: Active Grant

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Watanabe, Itsuo, Fukushima, Naoki, Kume, Masahide, Tatsuzawa, Takashi
• Granted Patent: US 7,785,708 B2
• Time in Patent Office: Days
• US Class Current: 257/783
• CPC Class Codes: C09J 2433/00 Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 7/10 without carriers
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/2857 : including metal or compound thereof or natural rubber
• CPC Class Codes: Y10T 428/2896 : including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Abstract

The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

Claims

1. An adhesive film for circuit connection, which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, the adhesive film comprising:

a curing agent to generate free radicals with heating;

a radically polymerizable substance; and

a film-forming polymer,

wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

2. The adhesive film for circuit connection according to claim 1, wherein the radically polymerizable substance is a radically polymerizable substance having a viscosity at 25°

C. in a range of 100,000 mpa.s to 1,000,000 mPa.s.

3. The adhesive film for circuit connection according to claim 2, wherein the curing agent is an organic peroxide whose temperature for the half-life of 10 hours is not less than 40°

C. and whose temperature for the half-life of 1 minute is not more than 180°

C.

4. The adhesive film for circuit connection according to claim 3, wherein an amount of the organic peroxide formulated is 0.05-10% by weight.

5. The adhesive film for circuit connection according to claim 2, wherein the radically polymerizable substance has a tricyclodecanyl group.

6. The adhesive film for circuit connection according to claim 5, wherein the radically polymerizable substance is an acrylate or a methacrylate.

7. The adhesive film for circuit connection according to claim 2, wherein the radically polymerizable substance comprises an urethane acrylate or an urethane methacrylate.

8. The adhesive film for circuit connection according to claim 2, wherein the radically polymerizable substance comprises a radically polymerizable substance having a triazine ring.

9. The adhesive film for circuit connection according to claim 2, wherein the film-forming polymer is contained in an amount of 80-180 parts by weight, relative to 100 parts by weight of the radically polymerizable substance.

10. The adhesive film for circuit connection according to claim 2, wherein a molecular weight of the film-forming polymer is 10,000-1,000,000.

11. The adhesive film for circuit connection according to claim 2, further comprising electrically conductive particles.

12. The adhesive film for circuit connection according to claim 11, wherein the electrically conductive particles have a coating layer of a noble metal on a transition metal and wherein a thickness of the coating layer is not less than 30 nm.

13. The adhesive film for circuit connection according to claim 2, further comprising a filler within a range of 5 to 60% by volume.

14. The adhesive film for circuit connection according to claim 11, comprising a first layer containing the curing agent, and a second layer containing the electrically conductive particles.

15. A circuit connection structure obtained in the following manner:

at least one of a first circuit member having a first circuit electrode and a second circuit member having a second circuit electrode is a flexible substrate;

the adhesive film for circuit connection as defined in claim 1 or 2 is temporarily fixed to the flexible substrate;

the first circuit member and the second circuit member are placed in a state in which the first circuit electrode and the second circuit electrode face each other;

the adhesive film for circuit connection is interposed between the first circuit electrode and the second circuit electrode placed in the facing state;

the adhesive film for circuit connection is heated and pressed to electrically connect the first circuit electrode and the second circuit electrode to each other.

16. A circuit connection structure comprising:

a first circuit member in which a first circuit electrode is formed on a first circuit substrate;

a second circuit member in which a second circuit electrode is formed on a second circuit substrate; and

a circuit connection member placed between the first circuit electrode and the second circuit electrode and connecting the first and second circuit members to each other,

wherein the circuit connection member is a cured product of the adhesive film for circuit connection as defined in claim 1 or 2 and wherein the first circuit electrode and the second circuit electrode are electrically connected through the circuit connection member.