Stage alignment in lithography tools

• US 20050151951A1
• Filed: 01/05/2005
• Published: 07/14/2005
• Est. Priority Date: 01/05/2004
• Status: Active Grant

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Hill, Henry A.
• Granted Patent: US 7,379,190 B2
• Time in Patent Office: Days
• US Class Current: 355/67
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder

Abstract

In general, in a first aspect, the invention features a lithography system that includes a stage for supporting a wafer, an illumination system including a radiation source and a lens assembly, wherein the illumination system is configured to direct radiation through a mask to produce spatially patterned radiation, and the lens assembly is configured to image the spatially patterned radiation onto the wafer, a first interferometry system configured to monitor a location of the stage within the lithography system as the stage moves relative to the illumination system, a second interferometry system configured to identify an alignment feature on a surface associated with the stage, and an electronic controller coupled to the interferometry systems, wherein the electronic controller is configured to determine information about a location of the stage when the alignment feature is identified.

Claims

1. A lithography system, comprising:

a stage for supporting a wafer;

an illumination system including a radiation source and a lens assembly, wherein the illumination system is configured to direct radiation through a mask to produce spatially patterned radiation, and the lens assembly is configured to image the spatially patterned radiation onto the wafer;

a first interferometry system configured to monitor a location of the stage within the lithography system as the stage moves relative to the illumination system;

a second interferometry system configured to identify an alignment feature on a surface associated with the stage; and

an electronic controller coupled to the interferometry systems, wherein the electronic controller is configured to determine information about a location of the stage when the alignment feature is identified.

2. The lithography system of claim 1, wherein the information comprises a location of the stage along a first axis within the lithography system.

3. The lithography system of claim 2, wherein the first interferometry system is configured to monitor the location of the stage along the first axis and along a second axis within the lithography system as the stage moves relative to the illumination system, wherein the second axis is different from the first axis.

4. The lithography system of claim 3, wherein the second interferometry system is configured to identify a second alignment feature on a surface associated with the stage.

5. The lithography system of claim 4, wherein the information further comprises a location of the stage along the second axis within the lithography system.

6. The lithography system of claim 5, wherein the first and second axes are in a plane nominally parallel to a plane of the wafer.

7. The lithography system of claim 1, wherein the surface is a surface of the stage.

8. The lithography system of claim 1, wherein the surface is a surface of the wafer.

9. The lithography system of claim 1, wherein the surface is a surface of a wafer chuck supported by the stage.

10. The lithography system of claim 1, wherein the alignment feature is located within about 0.5 mm or less from a plane of a surface of the wafer.

11. An interferometry system for identifying an alignment feature on a surface associated with a stage within a lithography tool, the interferometry system comprising:

an interferometer configured to direct two beams derived from a common light source along different paths and to combine light from the two beams that is reflected from the alignment feature to form an output beam comprising information about the location of the alignment feature with respect to the two beams.

12. The interferometry system of claim 11, further comprising an electronic controller configured to determine information about a location of the stage within the lithography tool when the alignment feature is identified.

13. The interferometry system of claim 12, wherein interferometry system identifies the alignment feature when the alignment feature is at a location where an optical path length difference between the two beam paths is about zero.

14. The interferometry system of claim 11, wherein the common light source has a coherence length of about 1 cm or less.

15. The interferometry system of claim 11, wherein the common light source is a broadband light source.

16. The interferometry system of claim 11, wherein the paths of the two beams each have a component parallel to the surface associated with the stage.

17. The interferometry system of claim 11, wherein the paths of the two beams each have a component normal to the surface associated with the stage.

18. The interferometry system of claim 11, wherein the interferometer comprises one or more focusing elements that focus the two beams to respective waists.

19. The interferometry system of claim 18, wherein the alignment feature is identified when the alignment feature is located at the respective beam waists.

20. The interferometry system of claim 11, wherein the interferometer is a Michelson interferometer.

21. The interferometry system of claim 11, wherein the interferometer has a numerical aperture for both of the two beams of about 0.1 or less.

22. The interferometry system of claim 11, wherein the interferometer comprises a beam splitter configured to split an input beam originating from the light source into the two beams.

23. The interferometry system of claim 22, wherein the beam splitter includes a beam splitting interface and the beam splitter is physically symmetric with respect to the interface.

24. The interferometry system of claim 12, further comprising a detector in communication with the electronic controller, the detector being configured to monitor the intensity of the output beam as the stage is moved within the lithography tool.

25. The interferometry system of claim 24, wherein the detector has a maximum detection frame rate of about 1 MHz or more.

26. The interferometry system of claim 24, wherein the detector comprises an array of detection elements.

27. The interferometry system of claim 24, wherein the detector comprises a single detection element.

28. The interferometry system of claim 11, wherein the alignment feature comprises a first facet and a second facet opposite the first facet.

29. The interferometry system of claim 28, wherein one of the two beams reflects from the first facet and the other of the two beams reflects from the second facet when the alignment feature is identified.

30. The interferometry system of claim 28, wherein the first facet is substantially orthogonal to the path of one of the two beams when the alignment is identified.

31. The interferometry system of claim 29, wherein the second facet is substantially orthogonal to the path of the other of the two beams when the alignment feature is identified.

32. A lithography tool, comprising:

a stage for supporting a wafer;

an illumination system including a radiation source and a lens assembly, wherein the illumination system is configured to direct radiation through a mask to produce spatially patterned radiation, and the lens assembly is configured to image the spatially patterned radiation onto the wafer;

a first interferometry system configured to monitor a location of the stage within the lithography system as the stage moves relative to the illumination system;

the interferometry system of claim 11;

and

an electronic controller coupled to the interferometry systems, wherein the electronic controller is configured to determine information about a location of the stage when the alignment feature is identified.

33. An apparatus, comprising:

a wafer stage having an alignment feature on a surface associated with the stage, the alignment feature having a first facet and a second facet opposite the first facet, wherein the first and second facets are non-parallel to a plane of the surface and each facet is configured reflect a beam from an interferometer designed to identify the alignment feature.

34. The lithography tool wafer stage of claim 33, wherein a surface normal to the first facet and a surface normal to the second facet each have a component along an axis along which the wafer stage is scanned or stepped within a lithography tool.

35. The lithography tool wafer stage of claim 33, wherein the alignment feature has a maximum width along the axis of about 1 cm or less.

36. The lithography tool wafer stage of claim 33, wherein the alignment feature has a maximum width along the axis of about 0.1 cm or less.

37. The lithography tool wafer stage of claim 33, wherein the alignment feature comprises a V-shaped pit or groove, or a pyramidal pit or groove in the surface.

38. The lithography tool wafer stage of claim 33, further comprising one or more additional alignment features on a surface associated with the stage.

39. A method, comprising:

directing two beams derived from a common source along different paths to contact a surface associated with a wafer stage; and

combining light from the two beams that is reflected from an alignment feature in the surface to form an output beam comprising information about the location of the alignment feature with respect to the two beams.

40. A method, comprising:

monitoring a location of a stage within the lithography system comprising an illumination system as the stage moves relative to an illumination system;

using an interferometry system to identify an alignment feature on a surface associated with the stage; and

determining information about a location of the stage within the lithography system when the alignment feature is identified.