Architecture for power modules such as power inverters
First Claim
Patent Images
1. A power converter, comprising:
- at least two switch modules, each of the switch modules comprising;
a housing of an electrically insulative side wall forming an interior and an exterior, the interior of the housing open to the exterior at a first end and at a second end;
a conductive member partially received by the side wall of the housing, the conductive member comprising an exterior portion extending into the exterior from the housing and a perimeter portion forming a shelf extending into the interior of the housing;
a conductive base plate comprising a first surface and a second surface opposed to the first surface;
at least one power terminal electrically coupled to the conductive base plate to conduct electrical current therebetween;
and a number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first one of the active terminals of each of the semiconductor switches surface mounted to the first surface of the conductive base plate, wherein the conductive base plate is coupled to the housing such that the first surface of the conductive base plate closes the opening at the second end of the housing and the semiconductor switches are disposed in the interior of the housing and the second surface of the conductive base plate is exposed to the exterior of the housing to transfer heat from the housing, wherein the at least one power terminal of a first one of the switch modules is electrically coupled to the conductive member of a second one of the switch modules.
2 Assignments
0 Petitions
Accused Products
Abstract
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
-
Citations
20 Claims
-
1. A power converter, comprising:
at least two switch modules, each of the switch modules comprising;
a housing of an electrically insulative side wall forming an interior and an exterior, the interior of the housing open to the exterior at a first end and at a second end;
a conductive member partially received by the side wall of the housing, the conductive member comprising an exterior portion extending into the exterior from the housing and a perimeter portion forming a shelf extending into the interior of the housing;
a conductive base plate comprising a first surface and a second surface opposed to the first surface;
at least one power terminal electrically coupled to the conductive base plate to conduct electrical current therebetween;
and a number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first one of the active terminals of each of the semiconductor switches surface mounted to the first surface of the conductive base plate, wherein the conductive base plate is coupled to the housing such that the first surface of the conductive base plate closes the opening at the second end of the housing and the semiconductor switches are disposed in the interior of the housing and the second surface of the conductive base plate is exposed to the exterior of the housing to transfer heat from the housing, wherein the at least one power terminal of a first one of the switch modules is electrically coupled to the conductive member of a second one of the switch modules. - View Dependent Claims (2, 3, 4)
-
5. A switch module, comprising:
-
a housing comprising an electrically insulative side wall forming an interior of the housing separated from an exterior of the housing, the interior of the housing open to the exterior at a first end and at a second end of the interior;
a conductive member partially received by the side wall of the housing, the conductive member comprising a first portion extending into the exterior from the housing and a perimeter portion forming a shelf extending into the interior of the housing;
a conductive base plate comprising a first surface and a second surface opposed to the first surface;
at least one power terminal electrically coupled to the conductive base plate to conduct electrical current therebetween; and
at least a first number of semiconductor switches, each of the switches comprising a first active terminal, a second active terminal and a control terminal, the first one of the active terminals of each of the first number of switches surface mounted to the first surface of the conductive base plate, wherein the conductive base plate is coupled to the housing such that the first surface of the conductive base plate closes the opening at the second end of the housing and the first number of semiconductor switches mounted to the first surface of the conductive base plate are disposed in the interior of the housing and the second surface of the conductive base plate is exposed to the exterior of the housing to transfer heat thereto. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A switch module, comprising:
-
a housing comprising an electrically insulative side wall separating an interior of the housing from an exterior of the housing, the interior of the housing open to the exterior at a first end and at a second end;
a conductive member supported by the housing, the conductive member comprising an exterior portion extending from the housing into the exterior and an interior portion comprising a pair of shelves extending from the housing into the interior from a pair of opposing sides of the interior of the housing;
a conductive base plate comprising a first surface and a second surface opposed to the first surface; and
a number of semiconductor switches carried by the first surface of the conductive base plate and electrically coupled between the conductive base plate and at least one of the pair of shelves of the conductive member, wherein the conductive base plate is coupled to the housing such that the first surface of the conductive base plate closes the opening at the second end of the housing with the semiconductor switches disposed in the interior of the housing between the pair of shelves of the conductive member, and the second surface of the conductive base plate is exposed to the exterior of the housing to transfer heat thereto. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification