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Stack up assembly

  • US 20050152117A1
  • Filed: 01/06/2005
  • Published: 07/14/2005
  • Est. Priority Date: 04/28/2003
  • Status: Active Grant
First Claim
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1. An assembly, comprising:

  • a first printed circuit board having a first opening and including a first heat-generating device;

    a second printed circuit board mechanically coupled to said first printed circuit board;

    a second heat-generating device;

    a first interposer configured to mechanically and electrically couple said second heat-generating device to said second printed circuit board;

    a heat sink mechanically coupled with said first and second printed circuit boards, thermally coupled with said first heat-generating device; and

    a gap-filling thermal interface configured to thermally couple said second-heat generating device with said heat sink.

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