Stack up assembly
First Claim
1. An assembly, comprising:
- a first printed circuit board having a first opening and including a first heat-generating device;
a second printed circuit board mechanically coupled to said first printed circuit board;
a second heat-generating device;
a first interposer configured to mechanically and electrically couple said second heat-generating device to said second printed circuit board;
a heat sink mechanically coupled with said first and second printed circuit boards, thermally coupled with said first heat-generating device; and
a gap-filling thermal interface configured to thermally couple said second-heat generating device with said heat sink.
3 Assignments
0 Petitions
Accused Products
Abstract
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
10 Citations
20 Claims
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1. An assembly, comprising:
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a first printed circuit board having a first opening and including a first heat-generating device;
a second printed circuit board mechanically coupled to said first printed circuit board;
a second heat-generating device;
a first interposer configured to mechanically and electrically couple said second heat-generating device to said second printed circuit board;
a heat sink mechanically coupled with said first and second printed circuit boards, thermally coupled with said first heat-generating device; and
a gap-filling thermal interface configured to thermally couple said second-heat generating device with said heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification