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SACRIFICIAL INORGANIC POLYMER INTERMETAL DIELECTRIC DAMASCENE WIRE AND VIA LINER

  • US 20050153505A1
  • Filed: 01/14/2004
  • Published: 07/14/2005
  • Est. Priority Date: 01/14/2004
  • Status: Active Grant
First Claim
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1. A method of forming an interconnect structure comprising the steps of:

  • providing a lower metal wiring layer having first metal lines located within a lower low-k dielectric;

    depositing an upper low-k dielectric atop said lower metal wiring layer;

    etching at least one portion of said upper low-k dielectric to provide at least one via to said first metal lines;

    forming rigid dielectric sidewall spacers in said at least one via of said upper low-k dielectric, said dielectric sidewall spacers are of a material selected from the group consisting of SiCH, SiCOH, SiC and SiO2; and

    forming second metal lines in said at least one portion of said upper low-k dielectric.

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