Edge termination in MOS transistors
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Abstract
A RESURF trench gate MOSFET has a sufficiently small pitch (close spacing of neighbouring trenches) that intermediate areas of the drain drift region are depleted in the blocking condition of the MOSFET. However, premature breakdown can still occur in this known device structure at the perimeter/edge of the active device area and/or adjacent the gate bondpad. To counter premature breakdown, the invention adopts two principles: the gate bondpad is either connected to an underlying stripe trench network surrounded by active cells, or is directly on top of the active cells, and a compatible 2D edge termination scheme is provided around the RESURF active device area. These principles can be implemented in various cellular layouts e.g. a concentric annular device geometry, which may be circular or rectangular or ellipsoidal, in the active area and in the edge termination, or a device array of such concentric hexagonal or circular stripe cells, or a device array of square active cells with stripe edge cells, or a device array of hexagonal active cells with an edge termination of hexagonal edge cells.
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Citations
20 Claims
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1-16. -16. (canceled)
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17. A method of manufacturing a semiconductor device comprises:
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forming in a semiconductor body an active cell area wherein trenches containing gate material extend into the semiconductor body from a surface thereof, and wherein adjacent to each trench gate there is provided a source region at said semiconductor body surface;
and also forming in the semiconductor body an inactive cell area wherein trenches containing gate material extend into the semiconductor body from the surface thereof, and wherein the source region is not included;
characterised in that a gate bondpad is laid at least partially over the active cell area, or an area substantially surrounded by the active cell area, and is connected thereto. - View Dependent Claims (18, 19, 20)
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Specification