Integrated circuit packages with sandwiched capacitors
First Claim
1. An integrated circuit (IC) package comprising:
- a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
at least one capacitor within the IC mounting region, wherein the at least one capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors, and wherein the at least one capacitor is mounted atop and at a diagonal to the first and second conductors to which it is electrically coupled; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitor.
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Accused Products
Abstract
To provide high-speed, low inductance capacitive decoupling, an integrated circuit (IC) package includes capacitors positioned within the mounting region between a die and an IC package substrate. A variety of types and sizes of capacitors and substrates can be employed in a variety of geometrical arrangements. In some embodiments, capacitors are sandwiched between die terminals or bumps and the substrate conductors or pads, while in other embodiments, capacitors are positioned between bar-type conductors on the surface of the IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
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Citations
24 Claims
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1. An integrated circuit (IC) package comprising:
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a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
at least one capacitor within the IC mounting region, wherein the at least one capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors, and wherein the at least one capacitor is mounted atop and at a diagonal to the first and second conductors to which it is electrically coupled; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit (IC) package comprising:
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a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors distributed substantially throughout the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface of each capacitor is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface of each capacitor is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitors. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. An integrated circuit (IC) package comprising:
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a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors within the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having terminals of first and second polarity types, wherein a terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to terminals of first and second polarity types on the top surface of the capacitors. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification