Circuit board device for information apparatus, multilayered module board and navigation system
First Claim
Patent Images
1. A circuit board device for an information apparatus comprising:
- a base board having mounted thereupon a plurality of low-frequency electronic components; and
a multilayer module board mounted at one surface of the base board and having mounted thereupon a plurality of high-frequency electronic components including at least a CPU and a memory, wherein;
at the multilayer module board which is a multilayered board smaller in size than the base board, the plurality of high-frequency electronic components are wired to one another through a wiring pattern at an inner layer.
2 Assignments
0 Petitions
Accused Products
Abstract
A multilayered module board with mounted high-frequency electronic components such as a CPU and a graphic circuit is mounted on one face of a base board with mounted low-frequency electronic components. The multilayered module board is a squared multilayered board smaller than the base board. The electronic components are wired with an inner layer-wiring pattern. Connector terminals are solder-jointed to four sides of the multilayered module board. The multilayered module board is mounted to the base board via the connector terminal.
-
Citations
14 Claims
-
1. A circuit board device for an information apparatus comprising:
-
a base board having mounted thereupon a plurality of low-frequency electronic components; and
a multilayer module board mounted at one surface of the base board and having mounted thereupon a plurality of high-frequency electronic components including at least a CPU and a memory, wherein;
at the multilayer module board which is a multilayered board smaller in size than the base board, the plurality of high-frequency electronic components are wired to one another through a wiring pattern at an inner layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 14)
-
-
9. A multilayer module board comprising:
-
a plurality of high-frequency electronic components including a CPU and a memory mounted at, at least, a surface thereof, wherein;
the plurality of high-frequency electronic components are connected with one another through a wiring pattern formed at an inner layer thereof;
the multilayer module board assumes an overall shape of a rectangle and has connector terminals provided as separate members each soldered onto one of four peripheral edges thereof;
the four connector terminals each include a narrow, elongated base portion constituted of resin and a plurality of pins fixed to the base portion; and
after the four connector terminals are each carried with the base portion attached to a transfer adapter, the four connector terminals are connected through soldering onto a rear surface of the board while attached to the transfer adapter.
-
-
10. A multilayer module board comprising:
-
a plurality of high-frequency electronic components including a CPU and a memory mounted at, at least, one surface thereof, wherein;
the plurality of high-frequency electronic components are connected with one another through a wiring pattern formed at an inner layer thereof;
the multilayer module board assumes an overall shape of a rectangle and has connector terminals provided as separate members each soldered onto one of four peripheral edges thereof;
the four connector terminals each include;
a narrow, elongated base portion constituted of resin;
a plurality of pins fixed to the base portion;
aligning pins projecting at both ends of the base portion to be used when soldering the connector terminal onto a rear surface of the board; and
inclined surfaces for position control formed at both ends of the base portion to be used when soldering the connector terminal;
a pair of positioning holes at which the aligning pins are loosely fitted are formed at each of four corners of the board; and
positions of the connector terminals are controlled when soldering the connector terminals as the inclined surfaces for position control at adjacent connector terminals come into contact with each other while the positioning pins are loosely fitted at the positioning holes.
-
-
11-13. -13. (canceled)
Specification