Piezoelectric o-ring transducer
First Claim
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1. An o-ring monitoring device for a vacuum system comprising:
- a piezoelectric element with a pair of ends for externally connecting to a signal processor;
said piezoelectric element disposed and placed to be fully insulated within a mold cavity, said mold cavity having a predetermined diameter and cross-section shape;
said mold cavity filled with an elastic material encapsulating said piezoelectric element therein.
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Abstract
An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.
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Citations
21 Claims
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1. An o-ring monitoring device for a vacuum system comprising:
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a piezoelectric element with a pair of ends for externally connecting to a signal processor;
said piezoelectric element disposed and placed to be fully insulated within a mold cavity, said mold cavity having a predetermined diameter and cross-section shape;
said mold cavity filled with an elastic material encapsulating said piezoelectric element therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A vacuum system comprising an o-ring sealing device.
said o-ring sealing device having a piezoelectric element molded therein; -
said piezoelectric element having a pair of lead wires that egress from an outer and side periphery of said o-ring;
said o-ring sealing device placed in an o-ring groove and compressed between two surfaces;
said pair of lead wires connected to a signal processor. - View Dependent Claims (10, 11, 12, 13)
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14. A method for monitoring compression stability of an o-ring seal during vacuum operations, comprising the steps of:
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providing an o-ring seal with a piezoelectric element encapsulated therein;
said piezoelectric element with a pair of ends for externally connecting to a signal processor;
said piezoelectric element placed within a mold cavity of a predetermined diameter and cross-section shape;
said mold cavity filled with an elastic material for molding an o-ring having a fully encapsulated and insulated piezoelectric element;
curing said molded o-ring, and placing said molded o-ring with an encapsulated piezoelectric element in an o-ring groove for sealing a vacuum chamber;
connecting said pair of ends of said conducting charge collectors to a signal processor for monitoring compression stability of said o-ring. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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Specification