Filter assembly, method of manufacturing the same, and plasma display panel using the same

• US 20050156525A1
• Filed: 01/18/2005
• Published: 07/21/2005
• Est. Priority Date: 01/17/2004
• Status: Active Grant

• Current Assignee: Samsung Corning Precision Materials Company Limited (Corning Incorporated)
• Original Assignee: Samsung Corning Precision Glass Company Limited (Corning Incorporated)
• Inventors: Choi, Kwi-Seok, Lim, Myung-Dok, Joo, Kyu-Nam, Park, Hyun-Ki
• Granted Patent: US 7,466,077 B2
• Time in Patent Office: Days
• US Class Current: 313/587
• CPC Class Codes: C03C 17/38 at least one coating being a coating of an organic material
• CPC Class Codes: H01J 2211/446 Electromagnetic shielding means; Antistatic means
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel

Abstract

A filter assembly, a plasma display panel with the filter assembly and a method of manufacturing the filter assembly. The plasma display panel includes a panel assembly, a chassis base on which a driving circuit is mounted and located on a rear of the panel assembly, a filter assembly mounted in front of the panel assembly, and a case that accommodates the panel assembly, the chassis base, and the filter assembly. The filter assembly includes a transparent substrate, an anti-reflection film, and an electromagnetic wave shielding filter attached to the rear surface of the substrate, and the electromagnetic wave shielding filter is grounded to the inner side of the case and is made of a metal mesh that includes a plating layer and a strike seed layer.

Claims

1. A filter assembly, comprising:

a substrate; and

an electromagnetic wave shielding filter attached to the substrate and comprising a polymer film and a metallic double layer structure arranged in a mesh pattern on the polymer film.

2. The filter assembly of claim 1, the metallic double layer structure comprises a strike layer and at least one plating layer on the strike layer.

3. The filter assembly of claim 1, the metallic double layer structure is formed by the process comprising:

preparing a metal plate for plating;

forming a strike layer on the metal plate;

forming a plating layer comprising at least one layer on an upper surface of the strike layer;

attaching a highly cohesive polymer film on an upper surface of the plating layer; and

separating the polymer film from the metal plate causing the plating layer to transfer to a lower surface of the polymer film.

4. The filter assembly of claim 3, the plating layer being arranged on the polymer film and the strike layer being arranged on the plating layer.

5. The filter assembly of claim 2, the strike layer comprising a metal selected from the group consisting of Cu, Fe, Al, Zn, Co, Mg, Cr, Cd, Ti, Ag, Au, In and an alloy of a combination of these metals.

6. The filter assembly of claim 2, the plating layer comprising a material selected from the group consisting of copper and silver.

7. The filter assembly of claim 6, the plating layer being 10-15 micrometers thick.

8. A plasma display panel, comprising:

a panel assembly;

a chassis base comprising a driving circuit, the chassis base being arranged on a rear of the panel assembly;

a filter assembly mounted in front of the panel assembly; and

a case that accommodates the panel assembly, the chassis base, and the filter assembly, the filter assembly comprises a transparent substrate, an anti-reflection film and an electromagnetic wave shielding filter, the filter being arranged on a rear surface of the substrate, the filter being grounded to an inner side of the case, the filter comprising a metal mesh that comprises a double layer structure that comprises a plating layer.

9. The plasma display panel of claim 8, the double layer structure comprises a strike layer and at least one plating layer on the strike layer.

10. The plasma display panel of claim 8, the metal mesh being formed by the process comprising:

forming the plating layer in a mesh shape on a metal plate;

attaching a highly cohesive polymer film to an upper surface of the plating layer; and

separating the polymer film from the metal plate causing the plating layer to separate from the metal plate while remaining attached to the polymer film.

11. The plasma display panel of claim 10, the plating layer being arranged on the polymer film and the strike layer being arranged on the plating layer.

12. The plasma display panel of claim 9, the strike layer serving as a seed layer during electrolytic plating, the strike layer comprising a metal selected from the group consisting of Cu, Fe, Al, Zn, Co, Mg, Cr, Cd, Ti, Ag, Au, In and an alloy thereof.

13. The plasma display panel of claim 9, the plating layer comprises a material selected from the group consisting of copper and silver.

14. A method, comprising:

preparing a metal plate for plating;

forming a photoresist layer in a mesh pattern on an upper surface of the metal plate;

forming a strike layer on portions of the upper surface of the metal plate absent photoresist;

forming a plating layer comprising at least one layer on an upper surface of the strike layer;

removing the photoresist layer from the metal plate;

attaching a highly cohesive polymer film to the upper surface of the metal plate; and

forming a plating layer in a double layer structure in a mesh pattern on a lower surface of the polymer film by separating the polymer film from the metal plate.

15. The method of claim 14, the metal plate for plating comprising a material selected from the group consisting of SUS, titanium, nickel, aluminum and an alloy of these metals.

16. The method of claim 14, the strike layer being comprised of a metal selected from the group consisting of Cu, Fe, Al, Zn, Co, Mg, Cr, Cd, Ti, Ag, Au, In and an alloy of these metals, the strike layer serving as a seed for the forming of the plating layer.

17. The method of claim 16, the strike layer being formed from an electrolytic solution that comprises nickel chloride 30-70 g/L and hydrochloric acid 5-20 ml/L, the strike layer being formed at current density of 1-20 A/dm² applied for 5-300 seconds.

18. The method of claim 14, the plating layer comprises a material selected from the group consisting of copper and silver.

19. The method of claim 14, after the separating, the plating layer being arranged on the polymer film and the strike layer being arranged on the plating layer.