Electronic pressure sensitive transducer apparatus and method for manufacturing same
2 Assignments
0 Petitions
Accused Products
Abstract
The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
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Citations
53 Claims
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1-10. -10. (canceled)
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11. A method of forming an electronic pressure sensitive transducer on a printed circuit board, the printed circuit board accepting a plurality of electronic components for processing signals generated by the pressure sensitive transducer, the method comprising:
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forming a plurality of conductive traces on the printed circuit board to form a contact area;
depositing at least one resistive layer on an inner side of a flexible substrate; and
assembling the flexible substrate on the printed circuit board such that the flexible substrate resistive layer is facing the printed circuit board conductive traces, the flexible substrate held to the printed circuit board by an adhesive substantially surrounding at least a portion of the contact area. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21-40. -40. (canceled)
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41. A method of forming a printed circuit board electronic pressure sensitive transducer assembly comprising:
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forming on the printed circuit board a plurality of conductive traces to form a contact area;
forming on the printed circuit board a plurality of conductive traces connecting the contact area with conductive pads for receiving electronic elements, the electronic elements processing pressure transducer signals;
soldering the electronic elements to the printed circuit board conductive pads;
printing a resistive layer on a flexible substrate;
printing an adhesive layer over a portion of the resistive layer; and
assembling the flexible substrate on the printed circuit board by contacting the adhesive with the printed circuit board such that the resistive layer faces the contact area. - View Dependent Claims (42, 43, 44)
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45. A transducer system comprising:
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a printed circuit board having a plurality of conductive traces, at least two of the traces defining each of a plurality of contact areas, the printed circuit board accepting electronic elements for processing electrical signals produced by a plurality of transducers, each signal indicative of pressure applied to at least one of the transducers;
at least one flexible substrate having an inner surface, one flexible substrate inner surface facing each contact area;
at least one adhesive spacer substantially surrounding each contact layer, each adhesive spacer attaching at least one flexible substrate to the printed circuit board; and
at least one resistive layer deposited on the at least one flexible substrate inner surface, each resistive layer contacting at least two of the traces in response to pressure applied to the at least one flexible substrate to produce the electrical signal indicative of the applied pressure;
wherein the plurality of contact areas, the at least one flexible substrate, the at least one adhesive spacer and the at least one resistive layer form the plurality of transducers, each transducer constructed on the printed circuit board. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52)
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53. A method of forming an electronic pressure sensitive transducer on a printed circuit board supporting electronic elements, the transducer having a flexible substrate with at least one resistive layer on an inner side of the flexible substrate facing the printed circuit board, the resistive layer contacting conductive traces in a contact area on the printed circuit board when pressure is applied to an outer side of the flexible substrate, the transducer further having a pedestal formed substantially around the contact area, the printed circuit board further having conductive traces connecting the electronic elements to the contact area, the method comprising:
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depositing conductive material on the printed circuit board; and
selectively removing a portion of the deposited conductive material to define the traces in the contact area, the traces connecting the electronic elements to the contact area, and at least a portion of the pedestal.
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Specification