Method and apparatus for the manufacture of a tag

• US 20050156807A1
• Filed: 02/14/2003
• Published: 07/21/2005
• Est. Priority Date: 02/14/2002
• Status: Abandoned Application

• Current Assignee: Ensid Investments, Ltd.
• Original Assignee: Ensid Investments, Ltd.
• Inventors: Clarke, Ross Robert
• Application Number:
  US10/504,615
• Publication Number:
  US 20050156807A1
• Time in Patent Office: Days
• US Class Current: 343/873
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A method of manufacturing a tag (100) having an electronic device, which may be a transponder (1) embedded in binding material, the method including applying a pre-coat of binding material (5) to the transponder (1), at least partially curing the pre-coat of binding material (5), locating the resulting pre-coated transponder (1) in further binding material (3) and curing the further binding material (3). The method may further include applying a vacuum to the binding material (5) and binding material (3), heating the binding materials and vibrating the binding materials. Apparatus for producing tags (100) is also described and claimed.

Claims

1. A method of manufacturing a tag having an electronic device embedded in binding material, the method including:

a) applying a pre-coat of binding material to an electronic device, said electronic device with the pre-coat of binding material applied being subjected to a vacuum;

b) at least partially curing the pre-coat of binding material;

c) curing the further binding material about the pre-coated electronic device.

2. The method of claim 1, wherein the pre-coat of binding material is the same material as the further binding material.

3. The method of claim 1, further including subjecting at least one of the pre-coat of binding material and further binding material to a vacuum prior to steps a) and c) respectively.

4. The method of claim 1, wherein step a) includes subjecting the electronic device and pre-coat of binding material to a vacuum prior to the application of the pre-coat of binding material and maintaining the vacuum during application of the pre-coat of binding material.

5. The method of claim 1, including subjecting the further binding material to a vacuum after performing step c).

6. The method of claim 4, further including vibrating at least one of the pre-coat of binding material and further binding material relative to the electronic device while the binding material is subjected to a vacuum.

7. The method of claim 1, wherein step b) is of sufficiently short duration so that when the resulting pre-coated electronic device is located in the further binding material, the pre-coat fuses with the further binding material.

8. The method of claim 1, further including applying heat to the pre-coat of binding material prior to performing step a).

9. The method of claim 1, further including applying heat to the further binding material prior to performing step c).

10. The method of claim 1, further including applying heat to the further binding material immediately after performing step c).

11. The method of claim 10, wherein the binding material is epoxy resin and the method includes applying heat to the further binding material at a temperature of approximately 60-100 degrees Celsius.

12. The method of claim 1, wherein step a) includes allowing the electronic device to locate within a volume of said binding material substantially under its own weight.

13. The method of claim 1, wherein step a) includes immersing the electronic device within a volume of said binding material at a speed approximate to the speed that the electronic device would sink into the binding material under its own weight.

14. The method of claim 1, wherein step c) includes allowing the pre-coated electronic device to locate within a volume of said further binding material substantially under its own weight.

15. The method of claim 1, wherein step c) includes immersing the pre-coated electronic device within a volume of said binding material at a speed approximate to the speed that the electronic device would sink into the binding material under its own weight.

16. The method of claim 13, wherein the speed of immersion is a maximum speed that has been predetermined experimentally.

17. The method of claim 1, wherein step c) includes locating the pre-coated electronic device and further binding material within a casing that forms an outer shell for the tag and step d) includes allowing the binding material to cure within the casing and wherein the casing includes one or more guides to position the pre-coated electronic device within the casing.

18. The method of claim 1, wherein step c) includes locating the pre-coated electronic device and further binding material within a casing that forms an outer shell for the tag and step d) includes allowing the binding material to cure within the casing.

19. The method of claim 17, wherein the pre-coat of binding material, further binding material and casing are constructed from materials suitable for consumption.

20. The method of claim 19, wherein the pre-coat of binding material and further binding material is epoxy resin and the casing is acrylic.

21. The method of claim 1, wherein the electronic device is a transponder.

22. The method of claim 1, wherein step d) includes partially curing at a first temperature greater than ambient temperature and the completing curing at a second temperature, less than the first temperature.

23. The method of claim 22, wherein the second temperature is ambient temperature.

24. The method of claim 1, wherein the produced tag has a length less than approximately 20 mm.

25. The method of claim 24, wherein the produced tag has a diameter less than approximately 15 mm.

26. The method of claim 24, wherein the produced tag has a diameter less than 10 mm.

27. A tag manufactured in accordance with the method of claim 1.

28. Apparatus for embedding electronic devices within a binding material;

the apparatus including;

a receptacle for holding material in a liquid state;

a mould or a jig for holding a casing;

filling means for filling said mould or a casing held by said jig with further binding material;

transport means and an associated controller operable to receive one or more electronic devices from a supply of electronic devices, perform a pre-coating operation by moving received electronic devices into said receptacle for holding material, and the move said electronic devices into said mould or into a casing held by said jig; and

a vacuum chamber containing said receptacle for holding binding material operable to create a vacuum about the receptacle during at least part of the pre-coating operation.

29. The apparatus of claim 28, wherein the transport means is further operable to move said mould or said casing into the vacuum chamber after it has moved said electronic devices into said mould or casing.

30. The apparatus of claim 28, wherein the transport means includes a closure means for the vacuum chamber that moves with the transport means and the transport means is engageable with the one or more electronic devices or with the mould or casing through an arm that extends into the vacuum chamber from the closure means when the closure means has closed the vacuum chamber.

31. The apparatus of claim 30, wherein the transport means includes a robotic arm assembly movable about a pivot located outside of the vacuum chamber.

32. The apparatus of claim 31 including two vacuum chambers located in different sectors about said pivot, each vacuum chamber including a receptacle for holding binding material in a liquid state and the robotic arm assembly includes two of said arms that extend into the vacuum chamber from the closure means when the closure means has closed the vacuum chamber, each movable about said pivot.

33. The method of claim 28, including two endless conveyors that index a plurality of said moulds or jigs past the transport means.

34. The apparatus of claim 33, wherein the filling means is located along said endless conveyors upstream of the transport means.

34-1. A method of manufacturing a tag substantially as herein described with references to the accompanying drawings.

35. Apparatus for manufacturing a tag substantially as herein described with reference to FIGS. 1 to 3 and 7 and either FIGS. 4 and 5 or FIG. 6.

36. A method of encasing an electronic device having a winding, comprising the steps of:

a) locating the electronic device in binding material;

b) evacuating air from behind the winding thereby replacing the evacuated air with binding material; and

c) allowing the binding material to cure.

37. The method of claim 36, further comprising:

a) partially curing said binding material;

b) immersing said electronic device with binding material into a further binding material; and

c) allowing said binding material and said further binding material to cure.

38. The method of claim 37, wherein said binding material and said further binding material are allowed to cure inside of a shell.

39. The method of claim 37, further comprising applying a vacuum to said further binding material at least one of during and after the electronic device and binding material are immersed into said further binding material.

40. The method of claim 36, further comprising heating said binding material while evacuating air from behind said winding.

41. The method of claim 36, wherein said electronic device is a transponder.

42. A tag comprising an electronic device having a winding:

a) wherein said electronic device is immersed in a binding material;

b) wherein said binding material is subjected to a vacuum to evacuate air from behind said winding to replace the air with said binding material; and

c) said electronic device is cured with said binding material.

43. The tag of claim 42, wherein said tag is manufactured by:

a) partially curing said binding material about said electronic device;

b) immersing said electronic device and binding material into a further binding material;

c) allowing said binding material and said further binding material to cure.

44. The tag of claim 43, further comprising a shell about said further binding material.

45. The tag of claim 44, wherein said shell comprises an open end, and said electronic device is introduced into said shell through said open end.