Off-axis levelling in lithographic projection apparatus

• US 20050157281A1
• Filed: 08/16/2004
• Published: 07/21/2005
• Est. Priority Date: 03/08/1999
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Jasper, Johannes C.M., Van Asten, Nicholaas A.A.J., Du Croo De Jongh, Richard J.H., Loopstra, Erik R., Modderman, Theodorus M., Nijmeijer, Gerrit J., Gemen, Jacobus, Boonman, Marcus E.J., Castenmiller, Thomas J.M., Heuts, Frederik T.E., Klinkhamer, Jacob F.F.
• Granted Patent: US 7,202,938 B2
• Time in Patent Office: Days
• US Class Current: 355/55
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7034 Leveling
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7096 Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus

Abstract

In an off-axis levelling procedure a height map of the substrate is generated at a measurement station. The height map is referenced to a physical reference surface of the substrate table. The physical reference surface may be a surface in which is inset a transmission image sensor. At the exposure station the height of the physical reference surface is measured and related to the focal plane of the projection lens. The height map can then be used to determine the optimum height and/or tilt of substrate table to position the exposure area on the substrate in best focus during exposure. The same principles can be applied to (reflective) masks.

Claims

1. A method of measuring the response of a level sensor comprising:

placing a substrate on a substrate table;

moving the substrate table to a known height;

measuring a height of an area of the substrate using the level sensor;

moving the substrate to a second known height;

measuring a height of the area of the substrate using the level sensor, and comparing the known heights with the measured heights using the level sensor to determine the response of the level sensor.

2. A method according to claim 1, further comprising correcting the response of the level sensor based upon the comparing.

3. A method according to claim 2, wherein the correcting comprises a gain correction.

4. A method according to claim 2, wherein the correcting comprises applying, for the entire substrate, a correction determined for the area.

5. A method according to claim 2, wherein a correction that is determined for the area of the substrate is applied for other substrates of a batch of substrates which have undergone a processing.

6. A method according to claim 1, further comprising measuring the response of the level sensor for a different area of the substrate which has undergone different processing than the area.

7. A method according to claim 1, wherein the height of the area of the substrate is measured using the level sensor for one or more additional known substrate table heights.

8. A method according to claim 7, wherein the correcting further comprises comparing the known heights with the measured heights.

9. A method according to claim 8, wherein the correcting comprises a nonlinear correction.

10. A method according to claim 8, wherein the correcting comprises applying, for the entire substrate, a correction determined for the area.

11. A method according to claim 8, wherein a correction that is determined for the area of the substrate is applied for other substrates of a batch of substrates which have undergone the same processing.

12. A method according to claim 7, further comprising reassuring the response of the level sensor, for a different area of the substrate, which has undergone different processing than the area.

13. A method according to claim 1, wherein the area of the substrate comprises an exposure area or die.

14. A method according to claim 1, wherein the known height is determined using an interferometer.

15. A method according to claim 14, wherein the interferometer measures the height of the substrate table.

16. A method according to claim 1, wherein the height measurements are performed within a linear or linearized range of the level sensor.