Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same

• US 20050158473A1
• Filed: 06/30/2004
• Published: 07/21/2005
• Est. Priority Date: 09/30/2002
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Raykin, Michael, Korolik, Mikhail, Woods, Carl, de Larios, John M., Smith, Michael G.R.
• Granted Patent: US 8,236,382 B2
• Time in Patent Office: Days
• US Class Current: 427/299
• CPC Class Codes: B08B 1/32 using rotary cleaning members
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

A method for preparing a surface of a substrate is provided. The method includes scanning the surface of the substrate by a meniscus, preparing the surface of the substrate using the meniscus, and performing a next preparation operation on the surface of the substrate that was prepared without performing a rinsing operation.

Claims

1. A method for preparing a surface of a substrate, the method comprising:

scanning the surface of the substrate using a meniscus;

preparing the surface of the substrate using the meniscus; and

performing a next preparation operation on the surface of the substrate that was prepared without performing a rinsing operation.

2. A method as recited in claim 1, wherein the surface of the substrate that was prepared is configured to be dry.

3. A method as recited in claim 1, wherein the meniscus includes a fluid having a substrate surface preparation property.

4. A method as recited in claim 1, wherein the operation of preparing the surface of the substrate includes one of a cleaning the surface of the substrate and stripping of a layer formed over the surface of the substrate.

5. A method as recited in claim 1, wherein the next preparation operation includes one of applying of a layer onto the surface of the substrate and storing the substrate.

6. A method as recited in claim 4, wherein the layer formed over the surface of the substrate to be stripped is an oxide layer.

7. A method as recited in claim 5, wherein the next operation is passivating a seed layer onto the surface of the substrate that was prepared.

8. A method for preparing a surface of a substrate, the method comprising:

applying a first meniscus onto the surface of the substrate so as to prepare the surface of the substrate; and

applying a second meniscus onto the surface of the substrate that was prepared so as to prepare the surface of the substrate that was prepared for a second time, the applying of the second meniscus configured to substantially directly follow applying of the first meniscus without performing a rinse operation.

9. A method as recited in claim 8, wherein the operation of preparing the surface of the substrate includes,

removing a layer formed over the substrate surface.

10. A method as recited in claim 8, wherein the operation of applying of the first meniscus onto the surface of the substrate is configured to leave the surface of the substrate substantially dry.

11. A method as recited in claim 8, wherein the operation of applying of the first meniscus onto the surface of the substrate is configured to generate precipitated residue.

12. A method as recited in claim 8, wherein the operation of applying the second meniscus onto the surface of the substrate that was prepared includes,

forming a layer of material over the surface of the substrate that was prepared.

13. A method as recited in claim 8, wherein the first meniscus includes a first chemistry and a second meniscus includes a second chemistry.

14. A method as recited in claim 13, wherein the layer of material formed over the surface of the substrate that was prepared is formed as a result of a chemical reaction between the second chemistry of the second meniscus and precipitated residue.

15. A method as recited in claim 8, wherein the first meniscus and the second meniscus are applied onto the substrate surface and the surface of the substrate that was prepared, respectively, substantially synchronously.

16. A method for preparing a front surface and a back surface of a substrate, the method comprising:

forming a front meniscus with the front surface of the substrate and a back meniscus with the back surface of the substrate;

scanning the front surface of the substrate and the back surface of the substrate with the front meniscus and the back meniscus, respectively, so as to substantially clean and dry the front surface of the substrate and the back surface of the substrate; and

performing a next substrate preparation process on the front surface of the substrate and the back surface of the substrate after the operation of scanning the front surface of the substrate and the back surface of the substrate without performing a rinsing operation.

17. A method as recited in claim 16, wherein the front meniscus includes a front cleaning chemistry and the back meniscus includes a back cleaning chemistry.

18. A method as recited in claim 16, wherein scanning the front surface of the substrate and the back surface of the substrate with the front meniscus and the back meniscus is configured to remove contaminant and liquid on the front surface of the substrate and the back surface of the substrate.

19. A method as recited in claim 17, wherein the front cleaning chemistry and the back cleaning chemistry each includes one of a hydrofluoric acid, standard clean 1 (SC1), standard clean 2 (SC2), ammonia, a surfactant, acidic acid, citric acid, a combination of acidic acid and citric acid, a combination of acidic acid, citric acid, and the surfactant, ammonium fluoride, mixed copper clean (MCC) 2500, MCC3000, and mixture of sulfuric acid and hydrogen peroxide.

20. A method as recited in claim 16, wherein the substrate is configured to rotate while the operation of scanning the front surface of the substrate and the back surface of the substrate with the front meniscus and the back meniscus is being performed.

21. A method as recited in claim 16, wherein each of the front meniscus and the back meniscus includes one of isopropyl alcohol (IPA) vapor, nitrogen, organic compounds, hexanol, ethylglycol, and compounds mixable with water.

22. A method as recited in claim 16, wherein scanning the front surface of the substrate and the back surface of the substrate is configured to occur substantially synchronously.