Substrate processing apparatus and substrate processing method

• US 20050158478A1
• Filed: 05/30/2003
• Published: 07/21/2005
• Est. Priority Date: 06/06/2002
• Status: Abandoned Application

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Katsuoka, Seiji, Watanabe, Teruyuki, Ogawa, Takahiro, Kobayashi, Kenichi, Sekimoto, Masahiko, Yokoyama, Toshio, Motojima, Yasuyuki, Miyazaki, Mitsuru
• Application Number:
  US10/514,030
• Publication Number:
  US 20050158478A1
• Time in Patent Office: Days
• US Class Current: 427/437
• CPC Class Codes: C23C 18/1619 Apparatus for electroless plating
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/02 Tanks; Installations therefor
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

A substrate processing apparatus has a processing tank (10) for plating a substrate (W) in a plating solution (Q) holds therein, a cover (40) for selectively opening and closing an opening (11) of the processing tank (10), a spraying nozzle (60) mounted on an upper surface of the cover (40), and a substrate head (80) for attracting a reverse side of the substrate (W) to hold the substrate (W). With the cover (40) removed from the opening (11) of the processing tank (10), the substrate head (80) is lowered to dip the substrate (W) in the plating solution (Q) for thereby plating the substrate (W). When the substrate head (80) is lifted and the opening (11) of the processing tank (10) is closed by the cover (40), the substrate (W) is cleaned by the spraying nozzle (60).

Claims

1. An apparatus for processing a substrate, comprising:

a first processing section bringing a processing liquid into contact with a surface to be processed of a substrate in such a state that the substrate held by a substrate head is inserted in a processing tank;

a substrate lifting/lowering mechanism for vertically moving the substrate held by the substrate head;

a cover for selectively opening and closing an opening of the processing tank; and

a second processing section for bringing a processing liquid into contact with the surface to be processed of the substrate held by the substrate head, above the cover which has closed the opening of the processing tank.

2. An apparatus according to claim 1, wherein said first processing section is of a structure for holding the processing liquid in the processing tank and dipping the surface to be processed of the substrate in the processing liquid, thereby to bring the processing liquid into contact with the surface to be processed of the substrate.

3. An apparatus according to claim 2, wherein said processing tank is adapted to eject and seal a gas therein.

4. An apparatus according to claim 1, wherein said first processing section is of a structure for bringing a processing liquid, which is ejected from a processing liquid ejecting section disposed in the processing tank, into contact with the surface to be processed of the substrate.

5. An apparatus according to claim 1, further comprising a processing liquid circulating system for retrieving the processing liquid which has been supplied to the processing tank, and supplying the processing liquid to the processing tank.

6. An apparatus according to claim 1, wherein said substrate head is of a structure for attracting a reverse side of the substrate to hold the substrate, thereby to bring the processing liquid into contact with the entire surface to be processed of the substrate.

7. An apparatus according to claim 1, wherein said substrate head is of a structure for attracting only a reverse side of the substrate to hold the substrate, thereby to produce a uniform flow of the processing liquid to be brought into contact with the surface to be processed of the substrate, and bring the processing liquid into uniform contact with the entire surface to be processed of the substrate, including an edge of the substrate.

8. An apparatus according to claim 2, wherein said substrate head is provided with a swinging mechanism for dipping the substrate held by the substrate head in the processing liquid held in the processing tank, while the substrate is being inclined a predetermined angle from a horizontal position.

9. An apparatus according to claim 1, further comprising an actuating mechanism for moving the cover between two positions including a retracted position in which the cover is positioned on a side of the processing tank and a closing position in which the cover is positioned above the processing tank and closes the opening of the processing tank.

10. An apparatus according to claim 1, wherein a processing liquid ejecting section is provided on an upper surface of the cover for bringing the processing liquid into contact with the surface to be processed of the substrate while the cover is closing the opening of the processing tank.

11. An apparatus according to claim 1, wherein a bank is provided on an upper surface of the cover for preventing the processing liquid remaining on the upper surface of the cover from falling into the processing tank when the cover is opened from a state in which the cover closes the opening of the processing tank.

12. An apparatus according to claim 1, wherein said cover has an upper surface having a slanted shape or a conical shape for allowing the processing liquid on the upper surface of the cover to flow down while the cover is closing the opening of the processing tank.

13. An apparatus according to claim 1, further comprising a wiper, a vibrator, or a cover rotating mechanism for removing the processing liquid which remains on an upper surface of the cover.

14. An apparatus according to claim 1, wherein said processing tank has on an upper portion thereof a slanted wall having an outside diameter which is progressively smaller in an upward direction, such that an outer wall at an upper end of the opening of the processing tank is positioned inwardly of an inner wall of the cover which covers the upper end of the opening.

15. A method of processing a substrate, comprising:

bringing a processing liquid into contact with a surface to be processed of a substrate in such a state that the substrate held by a substrate head is inserted in a processing tank;

closing an opening of the processing tank with a cover in such a state that the substrate held by the substrate is lifted above the processing tank; and

bringing a processing liquid into contact with the surface to be processed of the substrate held by the substrate head, above the cover which has closed the opening of the processing tank.

16. A method according to claim 15, wherein the bringing the processing liquid into contact with the surface to be processed of the substrate in the processing tank comprises the steps of storing the processing liquid in the processing tank and dipping the surface to be processed of the substrate in the processing liquid.

17. A method according to claim 16, further comprising filling the processing tank with an inactive gas when the opening of the processing tank is closed by the cover, thereby protecting the processing liquid in the processing tank.

18. A method according to claim 15, wherein the bringing the processing liquid into contact with the surface to be processed of the substrate in the processing tank comprises a step of ejecting a processing liquid ejected from a processing liquid ejecting section disposed in the processing tank into contact with the surface to be processed of the substrate.

19. A method according to claim 15, further comprising retrieving the processing liquid which has been supplied to the processing tank and supplying the processing liquid to the processing tank.

20. A method according to claim 15, wherein said substrate head attracts a reverse side of the substrate to hold the substrate.

21. A method according to claim 15, wherein said substrate head attracts only a reverse side of the substrate to hold the substrate thereby to produce a uniform flow of the processing liquid to be brought into contact with the surface to be processed of the substrate, and bring the processing liquid into uniform contact with the entire surface to be processed of the substrate, including an edge of the substrate.

22. A method according to claim 21, wherein said uniform flow of the processing liquid discharges, from the surface to be processed, air bubbles flowing onto the surface to be processed of the substrate or air bubbles generated when the processing liquid is brought into contact with the surface to be processed of the substrate.

23. A method according to claim 16, wherein the dipping the surface to be processed of the substrate in the processing liquid comprises a step of dipping the surface to be processed of the substrate in the processing liquid in the processing tank while the substrate is being tilted.

24. A method according to claim 15, wherein the opening of the processing tank is selectively opened and closed by the cover by moving the cover between two positions including a retracted position in which the cover is positioned on a side of the processing tank and a closing position in which the cover is positioned above the processing tank and closes the opening of the processing tank.

25. A method according to claim 15, wherein the bringing the processing liquid into contact with the surface to be processed of the substrate above the cover comprises a step of ejecting a processing liquid ejected from a processing liquid ejecting section mounted on an upper surface of the cover to the substrate.