Method for immobolizing molecules on surfaces

• US 20050158848A1
• Filed: 04/10/2003
• Published: 07/21/2005
• Est. Priority Date: 04/12/2002
• Status: Abandoned Application

• Current Assignee: Micronas Holding GmbH (TDK Corporation)
• Original Assignee: Micronas Holding GmbH (TDK Corporation)
• Inventors: Sieben, Ulrich, Freund, Ingo, Klapproth, Holger
• Application Number:
  US10/511,192
• Publication Number:
  US 20050158848A1
• Time in Patent Office: Days
• US Class Current: 435/287.200
• CPC Class Codes: B01J 20/103 comprising silica
• CPC Class Codes: B01J 20/28011 Other properties, e.g. density, crush strength
• CPC Class Codes: B01J 20/3204 Inorganic carriers, supports or substrates
• CPC Class Codes: B01J 20/3257 the functional group or the linking, spacer or anchoring group as a whole comprising at least one of the heteroatoms nitrogen, oxygen or sulfur together with at least one silicon atom, these atoms not being part of the carrier as such
• CPC Class Codes: B01J 20/327 Polymers obtained by reactions involving only carbon to carbon unsaturated bonds
• CPC Class Codes: B01J 20/3272 Polymers obtained by reactions otherwise than involving only carbon to carbon unsaturated bonds
• CPC Class Codes: B01J 20/3274 Proteins, nucleic acids, polysaccharides, antibodies or antigens
• CPC Class Codes: B01J 20/3276 Copolymers
• CPC Class Codes: B01J 20/3289 Coatings involving more than one layer of same or different nature
• CPC Class Codes: G01N 33/54393 Improving reaction conditions or stability, e.g. by coating or irradiation of surface, by reduction of non-specific binding, by promotion of specific binding

Abstract

In a method for immobilizing molecules on a surface, a layer of a hydrophobic, e.g., a non-swelling polymer, may be applied to the surface and molecules are immobilized on a surface of the polymer layer. The hydrophobic polymers may be polyimide or polystyrene, and the surface to which the polymer layer is applied may be made of an inorganic material, e.g., a semiconductor material (silicon), a semiconducting oxide (silicon dioxide), glass, nitride, or ceramic. Hydrophobic polymers such as polyimide or polystyrene can be applied to the surface of an inorganic support with conventional methods. Further, they electrically insulate the support with respect to the molecules applied to the surface of the polymer layer or substances associated with these molecules. Thus, electrical sensors and processor circuits can be integrated into the support without any detrimental effect on their function due to molecules and substances applied to the surface of the polymer layer.

Claims

1. A method for immobilizing molecules on a surfaces of a support in which electrical sensors and processor circuits are integrated, the method comprising the steps of:

applying a layer of a hydrophobic polymer to the surface; and

immobilizing molecules on a surface of the layer.

2. The method of claim 1, wherein the polymer is from the group comprising a polyimide and a polystyrene.

3. The method of claim 1, wherein the polymer layer is applied to the surface in previously defined regions.

4. The method of claim 1, wherein an electric charge is imparted to the surface of the polymer layer, at least in sectional fashion, by plasma treatment.

5. The method of claim 1, wherein UV-reactive molecules are covalently immobilized by irradiation with UV light.

7. The method of claim 1, wherein a portion of the surface of the polymer layer is utilized for application with an integrated circuit.

6. The method of claim 21, wherein the polymer layer is activated, at least in sectional fashion, in an oxygen plasma.

8. A method for immobilizing molecules on a surface, comprising the steps of applying a layer of a hydrophobic polymer to the surface, and immobilizing molecules on a surface of the layer.

9. The method of claim 8, where the polymer is a polyimide.

10. The method of claim 8, where the polymer is a polystyrene.

11. The method of claim 8, further comprising the steps of forming at least one defined region on the surface, and applying the layer of a hydrophobic polymer to the at least one defined region on the surface.

12. The method of claim 8, where the polymer layer is activated in an oxygen plasma.

13. The method of claim 8, where UV-reactive molecules are covalently immobilized by irradiation with UV light.

14. The method of claim 8, where an electric charge is imparted to the surface of the polymer layer by plasma treatment.

15. The method of claim 8, where the molecules are biomolecules.

16. The method of claim 8, where the polymer comprises a non-swelling polymer.

17. The method of claim 8, where the surface to which the polymer layer is applied may comprise an inorganic material.

18. The method of claim 17, where the inorganic material is a semiconductor material.

19. The method of claim 18, where the semiconductor material comprises silicon.

20. The method of claim 17, where the inorganic material is a semiconducting oxide.