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Yield based, in-line defect sampling method

  • US 20050158887A1
  • Filed: 02/09/2005
  • Published: 07/21/2005
  • Est. Priority Date: 08/21/1998
  • Status: Abandoned Application
First Claim
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1. A wafer comprising:

  • a plurality of semiconductor dice located on a wafer having a determined number of defects, each of the defects having a known size and location and having an effect of semiconductor die yield for the plurality of semiconductor dice of the wafer, an estimated semiconductor die yield loss (DYL) of the semiconductor die of the plurality of semiconductor dice of the wafer determined based on number and weight of the defect(s) on each semiconductor die of the plurality of semiconductor dice of the wafer, the estimated semiconductor die yield loss having lower and upper limits for summing all of the DYL of the plurality of semiconductor dice on the wafer for obtaining a wafer yield loss (WYL), the defects of the plurality of semiconductor dice of the wafer subdivided into a plurality of size range populations of defects for the plurality of semiconductor dice of the wafer, the relative contribution of each size range population of defects of the plurality of the semiconductor dice determining the wafer yield loss (WYL).

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