Miniaturized imaging device with integrated circuit connector system

• US 20050158899A1
• Filed: 02/17/2005
• Published: 07/21/2005
• Est. Priority Date: 03/18/2002
• Status: Active Grant

• Current Assignee: SARCOS LC (Sarcos Technology & Robotics Corp.)
• Original Assignee: Sarcos Investments LC
• Inventors: Marceau, David P., Markus, David T., Jacobsen, Stephen C., Pensel, Ralph W.
• Granted Patent: US 7,166,537 B2
• Time in Patent Office: Days
• US Class Current: 438/29
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.

Claims

1. A method of making an adaptor, comprising:

(a) applying a conductive material layer to an adaptor substrate;

(b) applying a photoresist material layer to the conductive material layer;

(c) developing a portion of the photoresist material layer, such that a first portion of the conductive material layer is exposed, and a second portion of the conductive material layer is protected; and

(d) removing the first portion of the conductive material from the adaptor substrate.

2. A method as in claim 1, comprising preliminary steps of applying a removable layer to a working substrate, followed by applying the adaptor substrate to the removable layer.

3. A method as in claim 2, comprising a step of removing the adaptor substrate from the removable layer after the first portion of the conductive material is removed from the adaptor substrate.

4. A method as in claim 2, wherein the step of developing the photoresist a portion of the photoresist material is by applying heat from beneath the working substrate, as well as applying UV light to a portion of the photoresist material that protects the first portion of the conductive material.

5. A method as in claim 1, wherein the photoresist material is completely removed after the first portion of the conductive material is removed from the adaptor substrate.

6. A method as in claim 1, wherein the adaptor is less than 500 microns in length, width, and height, respectively.

7. A method as in claim 1, further comprising the step of forming a hole through the adaptor substrate, thereby configuring the adaptor to support a lens.